18201967. CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 CHEMICAL MECHANICAL POLISHING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHEMICAL MECHANICAL POLISHING APPARATUS
Organization Name
Inventor(s)
DONGHOON Kwon of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18201967 titled 'CHEMICAL MECHANICAL POLISHING APPARATUS
Simplified Explanation
The chemical mechanical polishing apparatus described in the abstract includes a unique combination of magnetic materials in the polishing pads to enhance the polishing process.
- The polishing platen features an electromagnet and is rotatable.
- The lower polishing pad consists of a first area with a magnetic material and a second area with a non-magnetic material, overlapping the electromagnet.
- The upper polishing pad contains a second magnetic material and overlaps the first area.
- The polishing head is responsible for providing a wafer on the upper polishing pad and is also rotatable.
Potential Applications
The technology could be applied in semiconductor manufacturing processes where precise polishing of wafers is required.
Problems Solved
This innovation helps in achieving uniform and efficient polishing of wafers, improving the overall quality of semiconductor devices.
Benefits
- Enhanced polishing performance - Increased productivity in semiconductor manufacturing - Improved quality control in wafer processing
Potential Commercial Applications
"Enhanced Magnetic Polishing Technology for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to the use of magnetic materials in polishing pads for semiconductor manufacturing processes.
Unanswered Questions
How does the presence of magnetic materials affect the overall efficiency of the polishing process?
The presence of magnetic materials in the polishing pads may enhance the polishing process by providing better control and uniformity, but the specific mechanisms involved are not detailed in the abstract.
What are the potential limitations or drawbacks of using magnetic materials in the polishing pads?
While the abstract highlights the benefits of using magnetic materials, it does not address any potential limitations or drawbacks that may arise from this technology.
Original Abstract Submitted
A chemical mechanical polishing apparatus includes a polishing platen that includes an electromagnet and is rotatable; a lower polishing pad that is positioned on the polishing platen, the lower polishing pad including a first area and a second area, the first area including a first magnetic material and the second area including a non-magnetic material, wherein the first area overlaps the electromagnet; an upper polishing pad that is positioned on the lower polishing pad, includes a second magnetic material, and overlaps the first area; and a polishing head configured to provide a wafer on the upper polishing pad and is rotatable.
