18201466. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
Organization Name
Inventor(s)
Hyunggyun Noh of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18201466 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
The semiconductor package consists of a substrate, a semiconductor chip on the substrate, heat dissipation reinforcements on the substrate, and an encapsulant molding the chip and reinforcements.
- The heat dissipation reinforcements are elongated and positioned along the sides and top of the semiconductor chip at a set distance.
- These reinforcements help in dissipating heat generated by the semiconductor chip efficiently.
- The encapsulant protects the chip and reinforcements while providing structural integrity to the package.
Potential Applications: - Electronic devices requiring efficient heat dissipation. - High-performance computing systems. - Automotive electronics where thermal management is crucial.
Problems Solved: - Improved thermal management in semiconductor packages. - Enhanced reliability and longevity of semiconductor devices.
Benefits: - Increased performance and reliability of electronic devices. - Better thermal management leading to longer lifespan of components. - Enhanced overall efficiency of semiconductor packages.
Commercial Applications: Title: Advanced Thermal Management Solutions for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, telecommunications, and industrial applications. It can improve the performance and reliability of electronic devices, leading to better customer satisfaction and market competitiveness.
Prior Art: Readers can explore prior art related to thermal management solutions in semiconductor packages, including research papers, patents, and industry publications.
Frequently Updated Research: Stay updated on the latest advancements in thermal management technologies for semiconductor packages to ensure optimal performance and reliability in electronic devices.
Questions about Semiconductor Package Thermal Management: 1. How does the placement of heat dissipation reinforcements impact the overall thermal performance of the semiconductor package? 2. What are the key factors to consider when designing an efficient thermal management system for semiconductor devices?
Original Abstract Submitted
A semiconductor package includes: a substrate; a semiconductor chip provided on the substrate; a plurality of heat dissipation reinforcements provided on the substrate; and an encapsulant, on the substrate, molding the semiconductor chip and the plurality of heat dissipation reinforcements. Each of the plurality of heat dissipation reinforcements has an elongated shape, and extends along lateral surfaces and an upper surface of the semiconductor chip at a predetermined interval from the semiconductor chip.
