18200224. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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PRINTED CIRCUIT BOARD

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Myong Keun Jung of Suwon-si (KR)

Hyun Woo Kwon of Suwon-si (KR)

PRINTED CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18200224 titled 'PRINTED CIRCUIT BOARD

The abstract describes a printed circuit board with two board units, each containing insulating layers, wiring layers, and metal layers filling via holes.

  • First board unit with a first insulating layer, first via hole, first wiring layer, and first metal layer in the via hole.
  • Second board unit with a second insulating layer, second via hole, second wiring layer, and second metal layer in the via hole.
  • Second board unit is placed on top of the first board unit, with higher wiring density and different plating structure in the metal layer.

Potential Applications: - Electronics manufacturing - Circuit design and development - Communication systems

Problems Solved: - Increased wiring density - Enhanced circuit performance - Improved signal transmission

Benefits: - Higher efficiency in electronic devices - Better signal integrity - Enhanced overall performance

Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Electronics This technology can be used in various industries such as telecommunications, consumer electronics, and automotive for improved product performance and reliability.

Questions about the technology: 1. How does the higher wiring density in the second wiring layer impact the overall performance of the circuit board? 2. What are the specific advantages of the different plating structure in the second metal layer compared to the first metal layer?


Original Abstract Submitted

A printed circuit board includes: a first board unit including a first insulating layer having a first via hole, a first wiring layer disposed on or in the first insulating layer, and a first via including a first metal layer substantially filling the first via hole; and a second board unit including a second insulating layer having a second via hole, a second wiring layer disposed on or in the second insulating layer, and a second via including a second metal layer substantially filling the second via hole. The second board unit is disposed on the first board unit, the second wiring layer has a higher wiring density than that of the first wiring layer, and the second metal layer has a plating structure different from that of the first metal layer.

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