18199071. PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18199071 titled 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
The abstract describes a printed circuit board with an insulation layer, a first connection pad embedded in the insulation layer, a conductive layer on the first connection pad, and a first solder resist layer on the insulation layer.
- Insulation layer with opposite first and second surfaces
- Embedded first connection pad with a surface recessed from the first surface of the insulation layer
- Conductive layer on the first connection pad, partially embedded in the insulation layer and partially protruding from the first surface
- First solder resist layer on the first surface of the insulation layer, with a surface level equal to or lower than the conductive layer
Potential Applications: - Electronics manufacturing - Circuit board assembly - Consumer electronics
Problems Solved: - Improved circuit board design - Enhanced electrical connections - Increased reliability in electronic devices
Benefits: - Better signal transmission - Reduced risk of short circuits - Enhanced durability of circuit boards
Commercial Applications: Title: "Advanced Printed Circuit Boards for Enhanced Electronics Manufacturing" This technology can be used in various industries such as telecommunications, automotive, and aerospace for manufacturing high-quality electronic devices.
Prior Art: Readers can explore IPC codes related to printed circuit boards and conductive layers for more information on prior art in this field.
Frequently Updated Research: Researchers are constantly developing new materials and techniques to improve the performance of printed circuit boards, stay updated on the latest advancements in the field.
Questions about Printed Circuit Boards: 1. How does the design of the insulation layer impact the overall performance of the circuit board? 2. What are the key differences between traditional circuit boards and those incorporating embedded connection pads and conductive layers?
Original Abstract Submitted
A printed circuit board includes an insulation layer having a first surface and a second surface which are opposite to each other, a first connection pad which is embedded in the insulation layer and has a surface recessed from the first surface of the insulation layer, a conductive layer which is located on the first connection pad and has a part embedded in the insulation layer and another part protruding from the first surface of the insulation layer, and a first solder resist layer which is located on the first surface of the insulation layer and has a surface which is at a level equal to or lower than a surface of the conductive layer.
