18198089. CHIP WET-TRANSFERRING DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 CHIP WET-TRANSFERRING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP WET-TRANSFERRING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP WET-TRANSFERRING DEVICE
Organization Name
Inventor(s)
Kyungwook Hwang of Suwon-si (KR)
Joonyong Park of Suwon-si (KR)
Sanghoon Song of Suwon-si (KR)
CHIP WET-TRANSFERRING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18198089 titled 'CHIP WET-TRANSFERRING DEVICE
Simplified Explanation
The chip wet-transferring device described in the abstract is a device that is used to remove micro-semiconductor chips from a transfer substrate using a magnetic field generator. Here is a simplified explanation of the abstract:
- The device includes a chamber, a support member, and a magnetic field generator.
- The support member holds a transfer substrate with grooves and micro-semiconductor chips.
- The magnetic field generator removes a micro-semiconductor chip from the substrate by generating a magnetic field.
Potential Applications
The technology could be used in semiconductor manufacturing processes to transfer chips between substrates efficiently.
Problems Solved
This technology solves the problem of manually transferring micro-semiconductor chips, which can be time-consuming and prone to errors.
Benefits
The device allows for automated and precise removal of micro-semiconductor chips, increasing efficiency and reducing the risk of damage.
Potential Commercial Applications
- Semiconductor manufacturing industry: for transferring chips during production processes.
Possible Prior Art
One possible prior art could be robotic arms used in semiconductor manufacturing processes to handle and transfer chips.
Unanswered Questions
How does the magnetic field generator ensure the precise removal of the micro-semiconductor chip?
The abstract does not provide details on how the magnetic field generator controls the movement of the chip.
Are there any limitations to the size or type of micro-semiconductor chips that can be transferred using this device?
The abstract does not mention any restrictions on the size or type of chips that can be transferred, so it is unclear if there are any limitations in this regard.
Original Abstract Submitted
A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.
