18197846. Interlayer for Resistivity Reduction in Metal Deposition Applications simplified abstract (Applied Materials, Inc.)
Contents
- 1 Interlayer for Resistivity Reduction in Metal Deposition Applications
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Interlayer for Resistivity Reduction in Metal Deposition Applications - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about the Technology
- 1.13 Original Abstract Submitted
Interlayer for Resistivity Reduction in Metal Deposition Applications
Organization Name
Inventor(s)
Sahil Jaykumar Patel of Sunnyvale CA (US)
Xianyuan Zhao of Santa Clara CA (US)
Aixi Zhang of Sunnyvale CA (US)
Interlayer for Resistivity Reduction in Metal Deposition Applications - A simplified explanation of the abstract
This abstract first appeared for US patent application 18197846 titled 'Interlayer for Resistivity Reduction in Metal Deposition Applications
Simplified Explanation
The patent application describes methods and apparatus for processing a substrate by depositing an amorphous interlayer and a metal layer on top of a metal-containing layer.
- An amorphous interlayer is deposited on a metal-containing layer on a substrate.
- A metal layer is then deposited on top of the amorphous interlayer.
Key Features and Innovation
- Deposition of an amorphous interlayer on a metal-containing layer.
- Subsequent deposition of a metal layer on the amorphous interlayer.
Potential Applications
This technology can be applied in various industries such as semiconductor manufacturing, electronics, and materials science.
Problems Solved
This technology addresses the need for improved substrate processing methods for metal-containing layers.
Benefits
- Enhanced substrate processing capabilities.
- Improved adhesion and performance of metal layers.
Commercial Applications
- Semiconductor manufacturing processes.
- Electronics industry for circuit fabrication.
- Materials science for advanced material development.
Prior Art
Readers can explore prior research on substrate processing methods, metal layer deposition, and amorphous interlayer applications in related fields.
Frequently Updated Research
Stay informed about the latest advancements in substrate processing techniques, metal layer deposition technologies, and materials science research.
Questions about the Technology
What are the potential industrial applications of this substrate processing technology?
This technology can be utilized in various industries such as semiconductor manufacturing, electronics, and materials science for improved substrate processing.
How does the deposition of an amorphous interlayer benefit the overall performance of the metal layer?
The amorphous interlayer enhances adhesion and performance of the metal layer by providing a stable interface between the metal-containing layer and the deposited metal layer.
Original Abstract Submitted
Methods and apparatus for processing a substrate are provided. In some embodiments, a method includes depositing an amorphous interlayer atop a first layer on a substrate, wherein the first layer is a metal-containing layer, and depositing a metal layer atop the amorphous interlayer.
