18196499. SUBSTRATE ANALYSIS SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)

SUBSTRATE ANALYSIS SYSTEM

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jonghyeok Park of Suwon-si (KR)

Kwangrak Kim of Suwon-si (KR)

Jiwoong Kim of Suwon-si (KR)

Hyenok Park of Suwon-si (KR)

Jeonghyeon Wang of Suwon-si (KR)

Myungjun Lee of Suwon-si (KR)

Yunje Cho of Suwon-si (KR)

Junghee Cho of Suwon-si (KR)

Yun Hwang of Suwon-si (KR)

SUBSTRATE ANALYSIS SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18196499 titled 'SUBSTRATE ANALYSIS SYSTEM

Simplified Explanation

The patent application describes a substrate analysis system that includes modules for loading/unloading substrates, milling pattern layers, measuring milling depth, and capturing images of analysis regions on the substrate.

• The load-lock module is responsible for loading/unloading substrates with pattern layers.
• The milling module forms a milling surface and removes at least a portion of the pattern layer.
• The depth measuring module measures the milling depth of an analysis region on the milling surface.
• The imaging module captures two-dimensional images of the analysis region.
• The control module circulates the substrate through the milling, depth measuring, and imaging modules if the milling depth is shallower than a set target depth.

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1. 1. 1. Potential Applications

- Semiconductor industry for analyzing pattern layers on substrates. - Quality control in manufacturing processes involving patterned substrates.

1. 1. 1. Problems Solved

- Accurate measurement and analysis of milling depth on substrates. - Efficient imaging and analysis of pattern layers on substrates.

1. 1. 1. Benefits

- Improved accuracy in substrate analysis. - Enhanced quality control in manufacturing processes.

1. 1. 1. Potential Commercial Applications
         1. Optimizing Substrate Analysis in Semiconductor Manufacturing

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1. 1. 1. Possible Prior Art

There are existing systems for substrate analysis that involve milling, depth measurement, and imaging processes. However, the specific method of adjusting the path of the ion beam based on an intensity map for horizontal movement in the milling region may be a novel feature of this patent application.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does the system handle substrates with varying thicknesses?

The abstract does not mention how the system accommodates substrates of different thicknesses and whether it adjusts the milling depth accordingly.

1. 1. 1. 1. What is the expected lifespan of the system components?

There is no information provided on the durability or maintenance requirements of the modules in the substrate analysis system.

Original Abstract Submitted

A substrate analysis system includes a load-lock module configured to load or unload a substrate on which a pattern layer is formed; a milling module configured to form a milling surface from which at least a portion of the pattern layer is removed; a depth measuring module configured to measure a milling depth of an analysis region formed on the milling surface; an imaging module configured to capture a two-dimensional image of the analysis region; and a control module controlling the substrate to circulate through the milling module, the depth measuring module, and the imaging module, when the milling depth is shallower than a set target depth, wherein the milling module adjusts a path of the ion beam so that the ion beam moves horizontally in the milling region according to a scanning profile received based on an intensity map of the ion beam.