18194114. DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)

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DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

Organization Name

SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventor(s)

Lei Zhang of Shenzhen (CN)

Shijian Qin of Shenzhen (CN)

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18194114 titled 'DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

The present invention provides a display panel and a manufacturing method thereof, and a display device. The display panel includes a light emitting device layer and an array substrate. The array substrate includes a substrate layer, an insulation module, a first conductive layer, and a second conductive layer. The insulation module is disposed on the substrate layer. The first conductive layer and the second conductive layer are disposed in the insulation module at different layers. The first conductive layer includes pad layers, and orthographic projections of the pad layers and the second conductive layer on the substrate layer are not overlapped. Alternatively, first grooves are provided on a surface of the substrate layer facing the conductive structure, and orthographic projections of the first grooves and the second conductive layer on the substrate layer are overlapped.

  • The display panel includes a unique array substrate design with multiple layers of conductive materials.
  • The first conductive layer consists of pad layers, ensuring efficient electrical connections.
  • The second conductive layer is strategically positioned to avoid overlap with the pad layers for optimal performance.
  • The substrate layer features grooves that align with the second conductive layer, enhancing overall functionality.
  • The manufacturing method of the display panel involves precise placement of the various layers to achieve a high-quality end product.

Potential Applications: - This technology can be utilized in the production of high-resolution display panels for electronic devices. - It can be integrated into smart TVs, smartphones, tablets, and other consumer electronics for enhanced visual experiences.

Problems Solved: - Improved electrical connectivity and performance in display panels. - Enhanced manufacturing processes for display devices.

Benefits: - Higher quality display panels with improved functionality. - Increased efficiency in manufacturing processes. - Enhanced visual experiences for consumers.

Commercial Applications: Title: Advanced Display Panel Technology for Consumer Electronics This technology can revolutionize the display panel industry by offering high-quality, efficient solutions for consumer electronics manufacturers. It can lead to the development of cutting-edge devices with superior visual performance, attracting a wide range of consumers in the market.

Questions about Display Panel Technology: 1. How does the unique array substrate design contribute to the overall performance of the display panel? 2. What are the potential implications of integrating this technology into various consumer electronics devices?


Original Abstract Submitted

The present invention provides a display panel and a manufacturing method thereof, and a display device. The display panel includes a light emitting device layer and an array substrate. The array substrate includes a substrate layer, an insulation module, a first conductive layer and a second conductive layer. The insulation module is disposed on the substrate layer. The first conductive layer and the second conductive layer are disposed in the insulation module at different layers. The first conductive layer includes pad layers, and orthographic projections of the pad layers and the second conductive layer on the substrate layer are not overlapped. Alternatively, first grooves are provided on a surface of the substrate layer facing the conductive structure, and orthographic projections of the first grooves and the second conductive layer on the substrate layer are overlapped.