18187738. TOP VIA INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

TOP VIA INTERCONNECT

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Christopher J. Waskiewicz of Rexford NY (US)

Chih-Chao Yang of Glenmont NY (US)

Huai Huang of Clifton Park NY (US)

Koichi Motoyama of Clifton Park NY (US)

Julien Frougier of Albany NY (US)

TOP VIA INTERCONNECT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18187738 titled 'TOP VIA INTERCONNECT

The semiconductor structure described in the abstract consists of first metal lines embedded in a first dielectric layer, second metal lines embedded in a second dielectric layer, with the second metal lines positioned above the first metal lines. A top via extends between one of the first metal lines and one of the second metal lines, with the top via being self-aligned to the one of the first metal lines. Additionally, at least one air gap is located adjacent to the top via between the first metal lines and the second metal lines.

• First metal lines embedded in a first dielectric layer
• Second metal lines embedded in a second dielectric layer positioned above the first metal lines
• Top via extending between first and second metal lines, self-aligned to the first metal line
• Presence of at least one air gap adjacent to the top via between the metal lines

Potential Applications: - Advanced semiconductor manufacturing - High-speed electronic devices - Integrated circuits

Problems Solved: - Improved signal transmission efficiency - Enhanced circuit performance - Reduction of signal interference

Benefits: - Increased speed and efficiency of electronic devices - Enhanced reliability of integrated circuits - Reduction of signal distortion

Commercial Applications: Title: Advanced Semiconductor Structures for High-Speed Electronics This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and servers, catering to the growing demand for faster and more reliable technology in various industries.

Questions about the technology: 1. How does the presence of air gaps between metal lines impact the performance of the semiconductor structure? 2. What are the key advantages of having self-aligned top vias in the semiconductor structure?

Original Abstract Submitted

A semiconductor structure including first metal lines embedded in a first dielectric layer, second metal lines embedded in a second dielectric layer, where the second metal lines arranged above the first metal lines, a top via extending between one of the first metal lines and one of the second metal lines, where the top via is self-aligned to the one of the first metal lines, and at least one air gap located adjacent to the top via between the first metal lines and the second metal lines.