18187660. INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hao-Yu Tung of HSINCHU CITY (TW)

Sheng-Fan Yang of HSINCHU CITY (TW)

Hung-Yi Chang of HSINCHU CITY (TW)

Yi-Tzeng Lin of HSINCHU CITY (TW)

Wei-Chiao Wang of HSINCHU CITY (TW)

Wei-Hsun Liao of HSINCHU CITY (TW)

INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18187660 titled 'INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

The interposer device described in the patent application consists of two bump regions, a channel region, a plurality of signal lines, and a plurality of ground lines. The bump regions are connected to semiconductor devices, while the channel region links the two bump regions. The signal lines are embedded in the bump regions and the channel region, transmitting circuit signals between the semiconductor devices. The ground lines are also embedded in the bump regions and the channel region to shield the signal lines.

• Each signal line in the bump regions includes a trunk portion, a turning portion, and a signal turning point connecting the two. The trunk portion runs parallel to a first direction, while the turning portion runs parallel to a second direction.

• The interposer device is designed to efficiently transmit circuit signals between semiconductor devices while providing shielding for the signal lines.

• The innovative design of the signal lines in the bump regions allows for effective transmission of signals while maintaining structural integrity.

• By embedding the signal lines and ground lines in the bump regions and channel region, the interposer device minimizes signal interference and ensures reliable communication between semiconductor devices.

• The interposer device offers a practical solution for enhancing signal transmission and reducing interference in electronic systems.

Potential Applications: - High-speed data transmission in electronic devices - Semiconductor testing and development - Advanced computing systems

Problems Solved: - Signal interference in electronic systems - Efficient signal transmission between semiconductor devices - Structural integrity of signal lines in interposer devices

Benefits: - Improved signal transmission efficiency - Enhanced reliability in electronic communication - Reduced signal interference in semiconductor devices

Commercial Applications: Title: Advanced Interposer Devices for Enhanced Signal Transmission The technology can be applied in various industries such as telecommunications, computing, and semiconductor manufacturing. It offers a competitive advantage by improving signal transmission efficiency and reducing interference in electronic systems.

Questions about Interposer Devices: 1. How does the design of the signal lines in the bump regions contribute to efficient signal transmission? The design of the signal lines, with trunk and turning portions, allows for effective signal transmission while maintaining structural integrity.

2. What are the potential applications of interposer devices in the semiconductor industry? Interposer devices can be used for high-speed data transmission, semiconductor testing, and in advanced computing systems.

Original Abstract Submitted

An interposer device comprises two bump regions, a channel region, a plurality of signal lines and a plurality of ground lines. The two bump regions are respectively coupled to two semiconductor devices. The channel region is connected between the two bump regions. The plurality of signal lines are embedded in the two bump regions and the channel region, and electrically connected to the two semiconductor devices for transmitting circuit signals. The plurality of ground lines are embedded in the two bump regions and the channel region for shielding the plurality of signal lines. In each bump region, each signal line comprises a trunk portion, a turning portion, and a signal turning point connected between the trunk portion and the turning portion. The trunk portion extends parallel to a first direction, and the turning portion extends parallel to a second direction.