18187001. THREE-DIMENSIONAL POWER COMBINERS simplified abstract (Intel Corporation)
Contents
THREE-DIMENSIONAL POWER COMBINERS
Organization Name
Inventor(s)
Telesphor Kamgaing of Chandler AZ (US)
Peter Baumgartner of Munich (DE)
Steven Callender of Denver CO (US)
Harald Gossner of Riemerling (DE)
Jonathan Jensen of Portland OR (US)
THREE-DIMENSIONAL POWER COMBINERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18187001 titled 'THREE-DIMENSIONAL POWER COMBINERS
An electronic assembly, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners are disclosed in this patent application. The electronic assembly includes a first die with a first transmission line and a second die with a second transmission line, stacked on top of each other.
- The first die and second die have conductive pathways connecting the transmission lines to connection points on the first die's face.
- The second die is positioned above the first die, with its face coupled to the first die's face.
- The electronic assembly utilizes three-dimensional power combiners to combine power from the transmission lines effectively.
Potential Applications: - Telecommunications equipment - Radar systems - Satellite communication devices
Problems Solved: - Efficient power combining in electronic assemblies - Space-saving design for integrated circuits
Benefits: - Improved power combining efficiency - Compact design for electronic assemblies - Enhanced performance in communication devices
Commercial Applications: Title: Three-Dimensional Power Combiners for Advanced Communication Devices This technology can be used in various commercial applications such as telecommunications equipment, radar systems, and satellite communication devices. The compact design and improved power combining efficiency make it ideal for high-performance communication devices in the market.
Questions about Three-Dimensional Power Combiners: 1. How does the three-dimensional power combiner technology improve power efficiency in communication devices? 2. What are the potential challenges in implementing three-dimensional power combiners in electronic assemblies?
Original Abstract Submitted
Disclosed herein are electronic assemblies, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners. An electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. Each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. The electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.
