18186781. INTEGRATED REDISTRIBUTION LAYER INDUCTORS simplified abstract (QUALCOMM Incorporated)
Contents
INTEGRATED REDISTRIBUTION LAYER INDUCTORS
Organization Name
Inventor(s)
Abhijeet Paul of Escondido CA (US)
Ravi Pramod Kumar Vedula of San Diego CA (US)
INTEGRATED REDISTRIBUTION LAYER INDUCTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18186781 titled 'INTEGRATED REDISTRIBUTION LAYER INDUCTORS
Simplified Explanation: The patent application describes an integrated circuit (IC) with an inductor formed from redistribution layers (RDLs) and an airgap in an interlayer dielectric (ILD) under the inductor to improve inductor isolation and achieve a high Q value.
Key Features and Innovation:
- Inductor formed from redistribution layers (RDLs)
- Airgap in interlayer dielectric (ILD) under the inductor
- Improved inductor isolation
- High Q value achieved
Potential Applications: The technology can be applied in various integrated circuits where high Q value inductors are required, such as RF circuits, power amplifiers, and filters.
Problems Solved: The technology addresses the need for high Q value inductors with improved isolation in integrated circuits.
Benefits:
- Improved inductor performance
- Enhanced inductor isolation
- Allows for placement of circuits under the inductor, resulting in smaller die size
Commercial Applications: Potential commercial applications include the development of high-performance RF circuits, power amplifiers, and filters for various electronic devices.
Prior Art: Readers can start searching for prior art related to this technology in the field of integrated circuit design and inductor fabrication processes.
Frequently Updated Research: Stay updated on the latest advancements in integrated circuit design and inductor technology to further enhance the performance of the described technology.
Questions about Inductor with Airgap in Interlayer Dielectric: 1. What are the key benefits of using an airgap in the interlayer dielectric under the inductor? 2. How does the technology improve inductor isolation in integrated circuits?
Original Abstract Submitted
Disclosed is an integrated circuit (IC) with an inductor formed from redistribution layers (RDLs). An airgap is provided in an interlayer dielectric (ILD) under the bottom most RDL that makes up the inductor. In this way, an inductor with high Q value is achieved. Also, inductor isolation is improved. Thus, circuits may be placed under the inductor resulting is a smaller die.
