18184968. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Contents
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor(s)
Ming-Tsu Chung of Hsinchu (TW)
Yung-Chi Lin of Su-Lin City (TW)
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18184968 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
The method described in the abstract involves bonding an integrated circuit die to a carrier substrate, filling the gap around the die with dielectric material, performing a bevel clean process to remove excess dielectric material, depositing a bonding layer, and bonding a wafer to the bonding layer.
- Bonding an integrated circuit die to a carrier substrate
- Filling the gap around the die with dielectric material
- Performing a bevel clean process to remove excess dielectric material
- Depositing a bonding layer on the dielectric material
- Bonding a wafer to the bonding layer
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Advanced packaging technologies
Problems Solved: - Ensuring secure bonding of integrated circuit dies - Improving the reliability of semiconductor devices - Enhancing the performance of electronic components
Benefits: - Increased efficiency in semiconductor assembly processes - Enhanced durability of integrated circuits - Improved overall quality of electronic devices
Commercial Applications: Title: Advanced Semiconductor Bonding Technology for Enhanced Device Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. The improved bonding process can lead to more reliable and durable products, ultimately benefiting consumers and manufacturers alike.
Prior Art: Readers interested in exploring prior art related to this technology can refer to patents and research papers in the fields of semiconductor packaging, microelectronics, and integrated circuit bonding techniques.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing are constantly exploring new methods and materials to enhance the performance and reliability of electronic devices. Stay updated on the latest advancements in integrated circuit bonding technologies for potential future applications.
Questions about Semiconductor Bonding Technology: 1. How does this advanced bonding method compare to traditional bonding techniques? This technology offers improved reliability and performance compared to traditional bonding methods by utilizing a more precise and efficient process.
2. What are the key factors to consider when selecting dielectric materials for gap filling in semiconductor bonding? The selection of dielectric materials plays a crucial role in ensuring proper insulation, adhesion, and thermal properties in semiconductor bonding applications.
Original Abstract Submitted
A method includes bonding an integrated circuit die to a carrier substrate, forming a gap-filling dielectric around the integrated circuit die and along the edge of the carrier substrate, performing a bevel clean process to remove portions of the gap-filling dielectric from the edge of the carrier substrate, after performing the bevel clean process, depositing a first bonding layer on the gap-filling dielectric and the integrated circuit die, forming a first dielectric layer on an outer sidewall of the first bonding layer, an outer sidewall of the gap-filling dielectric, and the first outer sidewall of the carrier substrate; and bonding a wafer to the first dielectric layer and the first bonding layer, wherein the wafer comprises a semiconductor substrate and a second dielectric layer on an outer sidewall of the semiconductor substrate.
