18184527. Upside-Down DRAM Package Structure simplified abstract (Apple Inc.)
Contents
Upside-Down DRAM Package Structure
Organization Name
Inventor(s)
Jiongxin Lu of Cupertino CA (US)
Kunzhong Hu of Cupertino CA (US)
Upside-Down DRAM Package Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 18184527 titled 'Upside-Down DRAM Package Structure
The abstract describes electronic package and package on package (PoP) structures, where the top electronic package in a PoP structure may include back-to-face stacked dies or face-to-back stacked dies.
- The top electronic package in a PoP structure can have back-to-face stacked dies, positioned between the top package substrate and an underlying package.
- Alternatively, the top electronic package can feature face-to-back stacked dies, with the top die facing the underlying package in a PoP structure.
Potential Applications: - This technology can be applied in the manufacturing of electronic devices such as smartphones, tablets, and laptops. - It can also be used in the automotive industry for advanced driver assistance systems (ADAS) and infotainment systems.
Problems Solved: - Provides a compact and efficient way to stack electronic components in a PoP structure. - Enhances the overall performance and functionality of electronic devices.
Benefits: - Increases the integration density of electronic components. - Improves thermal management and signal integrity in electronic packages.
Commercial Applications: - The technology can be utilized by semiconductor companies, electronics manufacturers, and automotive companies to enhance their product offerings and stay competitive in the market.
Questions about Electronic Package and PoP Structures: 1. How does the orientation of the stacked dies in the top electronic package impact the overall performance of the PoP structure? 2. What are the key differences between back-to-face stacked dies and face-to-back stacked dies in electronic packages?
Original Abstract Submitted
Electronic package and package on package (PoP) structures are described. The electronic package may be a top electronic package in a PoP structure. In an embodiment, the top electronic package includes back-to-face stacked dies and the top electronic package is inverted such that the stacked dies are between the top package substrate and an underlying package in a PoP structure. In an embodiment, the top electronic package includes face-to-back stacked dies such that the top die of the top electronic package is facing the underlying package in a PoP structure.
