18183000. METHODS FOR UPPER PLATEN MANUFACTURING simplified abstract (Applied Materials, Inc.)

METHODS FOR UPPER PLATEN MANUFACTURING

Organization Name

Applied Materials, Inc.

Inventor(s)

Ximeng Xue of Santa Clara CA (US)

David J. Lischka of Austin TX (US)

Jay Gurusamy of Santa Clara CA (US)

Steven M. Zuniga of Soquel CA (US)

Jeonghoon Oh of Saratoga CA (US)

Jagan Rangarajan of San Jose CA (US)

METHODS FOR UPPER PLATEN MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18183000 titled 'METHODS FOR UPPER PLATEN MANUFACTURING

Simplified Explanation

This patent application describes a method and apparatus for additive manufacturing of a component for a semiconductor processing apparatus. The method involves depositing layers to build the component, creating cooling channels within the component, filling the channels with a filler material, and then draining the effluent fluid produced by a reaction with a liquidizing agent.

• The apparatus includes a printhead that selectively deposits layers to build the component.
• Cooling channels are formed within the component by depositing layers with gaps that are later filled with a filler material.
• The cooling channels are covered with additional layers before being exposed to a liquidizing agent.
• The liquidizing agent reacts with the filler material to produce an effluent fluid that is drained from the component.
• In some embodiments, the cooling channels may be machined into the component before being filled with the filler material.

Key Features and Innovation

• Selective deposition of layers to build a component with cooling channels.
• Filling cooling channels with a filler material to enhance cooling efficiency.
• Draining effluent fluid produced by a reaction with a liquidizing agent.
• Machining cooling channels into the component before filling them with filler material.

Potential Applications

This technology can be applied in the manufacturing of semiconductor processing apparatus components, where efficient cooling is crucial for optimal performance.

Problems Solved

This technology addresses the need for effective cooling solutions in semiconductor processing apparatus components.

Benefits

• Enhanced cooling efficiency.
• Improved performance of semiconductor processing apparatus components.
• Cost-effective additive manufacturing process.

Commercial Applications

1. 1. 1. Potential Commercial Uses and Market Implications

This technology can be utilized by manufacturers of semiconductor processing apparatus components to improve cooling capabilities and overall performance, potentially leading to increased market competitiveness.

Prior Art

Further research can be conducted in the field of additive manufacturing for semiconductor processing apparatus components to explore existing technologies and innovations.

Frequently Updated Research

There may be ongoing research in the field of additive manufacturing techniques for semiconductor processing apparatus components to enhance cooling efficiency and performance.

Questions about Additive Manufacturing for Semiconductor Processing Apparatus Components

What are the key advantages of using additive manufacturing for semiconductor processing apparatus components?

Additive manufacturing allows for the creation of complex geometries and intricate designs that may not be achievable through traditional manufacturing methods. This can result in components with enhanced performance and efficiency.

How does the use of cooling channels filled with filler material improve the performance of semiconductor processing apparatus components?

Cooling channels filled with filler material can dissipate heat more effectively, leading to improved thermal management and overall performance of semiconductor processing apparatus components.

Original Abstract Submitted

Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.