18180024. THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Yutaka Suzuki of Allen TX (US)
Rajen Murugan of Dallas TX (US)
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP - A simplified explanation of the abstract
This abstract first appeared for US patent application 18180024 titled 'THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
The abstract describes an electronic device that includes a semiconductor die with a conductive terminal, a conductive lead, a package structure enclosing a portion of the die, and a thermally conductive layer on the die's second side.
- Semiconductor die with a conductive terminal and a conductive lead for electrical coupling.
- Package structure enclosing a portion of the semiconductor die, made of a first molding compound with a specific thermal conductivity.
- Thermally conductive layer on at least a portion of the semiconductor die's second side, made of a second molding compound with a higher thermal conductivity than the first molding compound.
Potential Applications: - Electronic devices requiring efficient heat dissipation. - High-performance computing systems. - Automotive electronics where thermal management is crucial.
Problems Solved: - Improved thermal management in electronic devices. - Enhanced reliability and longevity of electronic components.
Benefits: - Increased efficiency in heat dissipation. - Extended lifespan of electronic devices. - Enhanced overall performance of electronic systems.
Commercial Applications: Title: "Advanced Thermal Management Solutions for Electronic Devices" This technology can be utilized in various industries such as consumer electronics, automotive, telecommunications, and industrial applications. It can improve the reliability and performance of electronic devices in demanding environments.
Questions about the technology: 1. How does the thermally conductive layer improve the performance of the electronic device? 2. What are the specific advantages of using different molding compounds with varying thermal conductivities in the package structure?
Original Abstract Submitted
An electronic device includes: a semiconductor die having opposite first and second sides and a conductive terminal along the first side; a conductive lead electrically coupled to the conductive terminal; a package structure that forms a top side of the electronic device and encloses a portion of the semiconductor die, the package structure including a first molding compound having a first thermal conductivity; and a thermally conductive layer on at least a portion of the second side of the semiconductor die, the thermally conductive layer including a second molding compound having a second thermal conductivity that is greater than the first thermal conductivity.
