18179676. ALUMINUM STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
ALUMINUM STRUCTURES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
ALUMINUM STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18179676 titled 'ALUMINUM STRUCTURES
The patent application describes devices with aluminum structures and methods of fabrication. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure consists of a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.
- Aluminum structures with interconnects
- First aluminum layer
- Migration barrier layer
- Second aluminum layer
- Electrical connection to interconnect structure
Potential Applications: - Semiconductor industry - Electronics manufacturing - Aerospace industry
Problems Solved: - Improved electrical conductivity - Enhanced structural integrity - Prevention of aluminum migration
Benefits: - Increased device performance - Longer lifespan of devices - Reduced maintenance costs
Commercial Applications: Title: Advanced Aluminum Structures for Enhanced Device Performance This technology can be utilized in the semiconductor industry for the production of high-performance electronic devices. It can also find applications in aerospace and other industries where reliable and efficient devices are required.
Prior Art: Readers can explore prior patents related to aluminum structures in the semiconductor industry to understand the evolution of this technology.
Frequently Updated Research: Researchers are continually exploring new methods to enhance the properties of aluminum structures for improved device performance.
Questions about Aluminum Structures: 1. How do aluminum structures impact the efficiency of electronic devices?
Aluminum structures play a crucial role in enhancing electrical conductivity and structural integrity in electronic devices.
2. What are the key challenges in fabricating aluminum structures for high-performance applications?
The main challenges include preventing aluminum migration and ensuring proper electrical connections within the structure.
Original Abstract Submitted
Devices with aluminum structures and methods of fabrication are provided. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure includes a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.
