18179223. SPLIT PAD WITH TEST LINE simplified abstract (QUALCOMM Incorporated)
Contents
SPLIT PAD WITH TEST LINE
Organization Name
Inventor(s)
Aniket Patil of San Diego CA (US)
Hong Bok We of San Diego CA (US)
Brigham Navaja of San Diego CA (US)
SPLIT PAD WITH TEST LINE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18179223 titled 'SPLIT PAD WITH TEST LINE
The abstract of the patent application describes apparatuses and techniques for fabricating the apparatuses, specifically focusing on an outer connection layer with split pads and a test line.
- The apparatus includes an outer connection layer with an outer substrate and an outer metallization layer.
- The outer metallization layer contains a first set of sense split pads, which include a first pad portion, a second pad portion, and a test line.
- The test line is connected to the first pad portion, and both pad portions are electrically coupled to the same interconnect.
Potential Applications: - This technology could be used in the manufacturing of electronic devices that require precise sensing capabilities. - It may find applications in the semiconductor industry for testing and quality control processes.
Problems Solved: - Provides a more efficient and accurate way to sense and test electronic components. - Enhances the reliability and performance of electronic devices by improving connection and testing methods.
Benefits: - Improved accuracy and reliability in sensing and testing electronic components. - Streamlined manufacturing processes for electronic devices. - Enhanced performance and quality control in the semiconductor industry.
Commercial Applications: Title: Advanced Sensing and Testing Technology for Electronic Devices This technology could be utilized in the production of smartphones, tablets, and other consumer electronics to ensure high-quality performance and reliability. It may also be valuable in the automotive industry for sensor testing and calibration.
Prior Art: Readers interested in exploring prior art related to this technology could start by researching patents in the field of semiconductor manufacturing, specifically focusing on sensing and testing methods for electronic components.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing and electronic device testing may be conducting studies on improving sensing and testing technologies for enhanced performance and reliability. Stay updated on the latest advancements in this area for potential future applications.
Questions about Advanced Sensing and Testing Technology: 1. How does this technology improve the accuracy of sensing electronic components? - This technology enhances accuracy by utilizing split pads and a test line to ensure precise connections and testing processes. 2. What are the potential commercial applications of this advanced sensing and testing technology? - This technology could be applied in various industries, including consumer electronics and automotive, for improved performance and reliability.
Original Abstract Submitted
Disclosed are apparatuses and techniques for fabricating the apparatuses. In an aspect, an apparatus includes an outer connection layer. The outer connection layer has an outer substrate and an outer metallization layer (ML). The outer ML includes a first set of sense split pads. The first set of sense split pads includes a first pad portion and a second pad portion and a test line. The test line is coupled to the first pad portion. The first pad portion and the second pad portion are electrically coupled to a same interconnect.
