18177404. DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract (QUALCOMM Incorporated)
Contents
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION
Organization Name
Inventor(s)
Changhan Hobie Yun of San Diego CA (US)
Paragkumar Ajaybhai Thadesar of San Diego CA (US)
Sameer Sunil Vadhavkar of San Diego CA (US)
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18177404 titled 'DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION
Simplified Explanation:
The patent application describes a device with a redistribution layer (RDL) substrate, a passive component, a first die, and a laminate substrate.
- The device includes a passive component located near the first surface of the RDL substrate.
- A first die is connected to the second surface of the RDL substrate through conductive pillars.
- A laminate substrate is attached to the first surface of the RDL substrate using conductive pillars.
Key Features and Innovation:
- Integration of a passive component in the RDL substrate.
- Use of conductive pillars to connect the first die to the RDL substrate.
- Attachment of a laminate substrate to the RDL substrate with conductive pillars.
Potential Applications:
This technology could be used in:
- Semiconductor devices
- Integrated circuits
- Electronic packaging
Problems Solved:
- Improved connectivity between components
- Enhanced performance of electronic devices
- Efficient use of space in device design
Benefits:
- Higher reliability in electronic systems
- Increased functionality in compact devices
- Simplified manufacturing processes
Commercial Applications:
Title: Advanced Electronic Packaging Technology for Semiconductor Devices
This technology has potential commercial applications in:
- Consumer electronics
- Telecommunications
- Automotive industry
Prior Art:
Readers can explore prior art related to this technology in the field of semiconductor packaging and electronic component integration.
Frequently Updated Research:
Stay updated on the latest advancements in semiconductor packaging and electronic device integration for potential improvements in this technology.
Questions about Electronic Packaging Technology:
1. What are the key advantages of using conductive pillars in electronic device packaging?
- Conductive pillars provide reliable electrical connections between components and enable efficient heat dissipation.
2. How does integrating passive components in the RDL substrate benefit electronic devices?
- Integrating passive components in the RDL substrate helps reduce the overall size of the device and improve signal integrity.
Original Abstract Submitted
A device is described, including a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL substrate, through at least a first pair of conductive pillars. The device also includes a laminate substrate coupled to the first surface of the RDL substrate through at least a second pair of conductive pillars.
