18177005. INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract (QUALCOMM Incorporated)
Contents
INTEGRATED DEVICE COMPRISING ELONGATED PADS
Organization Name
Inventor(s)
Yangyang Sun of San Diego CA (US)
Amer Christophe Gaetan Cassier of La Jolla CA (US)
INTEGRATED DEVICE COMPRISING ELONGATED PADS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18177005 titled 'INTEGRATED DEVICE COMPRISING ELONGATED PADS
The abstract describes a device with an integrated device that includes a die substrate, an interconnect portion, a plurality of pillar interconnects, and a passivation layer.
- The interconnect portion has a first plurality of pads for input/output signals and a second plurality of pads for power distribution.
- The pillar interconnects are connected to both sets of pads for electrical connectivity.
- The passivation layer has openings, including at least one over a pad from the first plurality.
Potential Applications: - This technology could be used in semiconductor devices, integrated circuits, and electronic components. - It may find applications in consumer electronics, telecommunications, and automotive industries.
Problems Solved: - Provides efficient electrical paths for both signals and power distribution. - Enhances the reliability and performance of integrated devices.
Benefits: - Improved signal integrity and power delivery. - Enhanced overall functionality and durability of electronic devices.
Commercial Applications: Title: Advanced Integrated Device Technology for Enhanced Performance in Electronics This technology can be utilized in the development of high-performance electronic devices, leading to improved functionality and reliability. It has the potential to impact various industries, including telecommunications, consumer electronics, and automotive sectors.
Prior Art: Readers can explore prior art related to integrated device technology, die substrates, interconnect structures, and passivation layers in semiconductor devices.
Frequently Updated Research: Stay updated on the latest advancements in integrated device technology, semiconductor manufacturing processes, and electronic component design for potential insights and improvements.
Questions about Integrated Device Technology: 1. How does this technology improve the efficiency of power distribution in electronic devices? 2. What are the key factors influencing the design of interconnect structures in integrated devices?
Original Abstract Submitted
A device comprising an integrated device. The integrated device comprising a die substrate; an interconnect portion coupled to the die substrate, a plurality of pillar interconnects and a passivation layer coupled to the interconnect portion. The interconnect portion includes a first plurality of pads and a second plurality of pads. The first plurality of pads are configured to provide a first plurality of electrical paths for input/output signals. The second plurality of pads are configured to provide a second plurality of electrical paths for power. The plurality of pillar interconnects are coupled to the first plurality of pads and the second plurality of pads. The passivation layer comprises a plurality of openings. The plurality of openings include at least one opening located over a pad from the first plurality of pads.
