18171992. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Kioxia Corporation)
Contents
- 1 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Organization Name
Inventor(s)
Shohei Arakawa of Mie Mie (JP)
Yuta Osada of Yokkaichi Mie (JP)
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18171992 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Simplified Explanation
The semiconductor manufacturing apparatus described in the abstract includes a chamber with a top plate, a holder for the substrate, a high-frequency power source, gas supply and discharge pipes, and lift pins to move the substrate away from the holder towards the top plate.
- The chamber includes a top plate.
- A holder is provided in the chamber to place a substrate.
- A high-frequency power source applies high-frequency power to the holder.
- A gas supply pipe provides gas to the chamber.
- A gas discharge pipe removes gas from the chamber.
- Lift pins move the substrate away from the holder towards the top plate.
Potential Applications
This technology can be used in the manufacturing of semiconductors, specifically in processes that require precise control over the positioning of substrates.
Problems Solved
This technology solves the problem of accurately moving substrates within a semiconductor manufacturing chamber, ensuring proper processing and avoiding damage to the substrate.
Benefits
The benefits of this technology include improved efficiency in semiconductor manufacturing processes, increased precision in substrate handling, and potentially higher quality end products.
Potential Commercial Applications
This technology could be applied in the production of various semiconductor devices, such as integrated circuits, memory chips, and sensors.
Possible Prior Art
One possible prior art for this technology could be similar semiconductor manufacturing apparatus with lift pins for substrate handling, but with different configurations or functionalities.
Unanswered Questions
How does this technology compare to existing substrate handling systems in terms of speed and precision?
This article does not provide a direct comparison between this technology and existing substrate handling systems in terms of speed and precision. Further research or testing would be needed to determine the specific advantages of this technology in comparison to others.
What are the potential maintenance requirements for the lift pins and other moving parts in this semiconductor manufacturing apparatus?
The article does not address the potential maintenance requirements for the lift pins and other moving parts in this semiconductor manufacturing apparatus. Understanding the maintenance needs of this technology would be crucial for its long-term use and reliability.
Original Abstract Submitted
A semiconductor manufacturing apparatus includes: a chamber including a top plate; a holder provided in the chamber and configured to place a substrate; a high-frequency power source configured to apply high-frequency power to the holder; a gas supply pipe configured to supply a gas to the chamber; a gas discharge pipe configured to discharge a gas from the chamber; and a plurality of lift pins configured to move the substrate in a direction away from the holder to the top plate, which allows tip ends of the lift pins to move from an upper surface of the holder to a position with a first distance, wherein the first distance is equal to or greater than about 70% of a second distance between the upper surface of the holder and the top plate.
