18170847. BANDWIDTH EXTENDED BALANCED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE simplified abstract (BAE Systems Information and Electronic Systems Integration Inc.)

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BANDWIDTH EXTENDED BALANCED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE

Organization Name

BAE Systems Information and Electronic Systems Integration Inc.

Inventor(s)

Alexander D. Johnson of Waltham MA (US)

James F. Fung of Manchester NH (US)

Randall R. Lapierre of Hooksett NH (US)

BANDWIDTH EXTENDED BALANCED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18170847 titled 'BANDWIDTH EXTENDED BALANCED TIGHTLY COUPLED DIPOLE ARRAY ADDITIVELY MANUFACTURED MODULAR APERTURE

The antenna assembly described in the patent application consists of a balanced antenna feed, a ground plane, two conductive dipole arms, feedlines, and an H-wall.

  • The balanced antenna feed is designed to receive a differential signal.
  • The first and second conductive dipole arms are in planar alignment with the ground plane and adjacent to each other.
  • The first feedline connects the first conductive dipole arm to the balanced antenna feed, while the second feedline connects the second conductive dipole arm to the balanced antenna feed.
  • The H-wall is in electrical communication with the ground plane and physically separate from the second conductive dipole arm, with an axial length orthogonal to the ground plane.

Potential Applications: - Wireless communication systems - Radio frequency identification (RFID) technology - Satellite communication systems

Problems Solved: - Improved signal reception and transmission - Enhanced antenna efficiency - Reduced interference and noise

Benefits: - Increased signal clarity and strength - Enhanced overall performance of communication systems - Better connectivity in challenging environments

Commercial Applications: Title: Advanced Antenna Assembly for Enhanced Wireless Communication This technology can be utilized in various industries such as telecommunications, aerospace, and IoT for improved signal transmission and reception, leading to better connectivity and performance in wireless communication systems.

Questions about the technology: 1. How does the balanced antenna feed improve signal reception compared to traditional feeds? 2. What advantages does the H-wall provide in terms of antenna performance and efficiency?


Original Abstract Submitted

An antenna assembly includes a balanced antenna feed configured to receive a differential signal and a ground plane. The assembly further includes a first conductive dipole arm in planar alignment with a surface of the ground plane and a second conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the first conductive dipole arm. The assembly further includes a first feedline in electrical communication with the first conductive dipole arm and the balanced antenna feed and a second feedline in electrical communication with the second conductive dipole arm and the balanced antenna feed. The assembly further includes a conductive wall (“H-wall”) in electrical communication with the ground plane and having an end adjacent to, and physically separate from, the second conductive dipole arm. The H-wall has an axial length orthogonal to the ground plane.

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