18169998. INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract (International Business Machines Corporation)

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

Organization Name

International Business Machines Corporation

Inventor(s)

John Knickerbocker of Monroe NY (US)

Mukta Ghate Farooq of HOPEWELL JCT NY (US)

Keiji Matsumoto of Yokohama-shi (JP)

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18169998 titled 'INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

Simplified Explanation

The patent application describes a semiconductor integrated circuit device with a thermally conducting solder surrounding the front-end-of-line region and back-end-of-line regions.

• The device includes a first back-end-of-line region connected to one side of the front-end-of-line region.
• A second back-end-of-line region is connected to the other side of the front-end-of-line region.
• A thermally conducting solder partially surrounds the perimeter of the front-end-of-line region and the back-end-of-line regions.

Key Features and Innovation

• Integration of a thermally conducting solder to enhance heat dissipation in a semiconductor integrated circuit device.
• Efficient cooling mechanism for the front-end-of-line and back-end-of-line regions.
• Improved thermal management to prevent overheating and enhance overall performance.

Potential Applications

The technology can be applied in various semiconductor devices, such as microprocessors, memory chips, and integrated circuits requiring efficient heat dissipation.

Problems Solved

• Addressing thermal management issues in semiconductor devices.
• Preventing overheating that can lead to performance degradation or failure.
• Enhancing the reliability and longevity of semiconductor integrated circuits.

Benefits

• Improved heat dissipation and thermal management.
• Enhanced performance and reliability of semiconductor devices.
• Extended lifespan of semiconductor integrated circuits.

Commercial Applications

Title: Enhanced Thermal Management for Semiconductor Devices This technology can be utilized in consumer electronics, automotive electronics, data centers, and industrial applications where efficient heat dissipation is crucial for optimal performance and reliability.

Prior Art

Readers can explore prior patents related to thermal management in semiconductor devices, soldering techniques, and heat dissipation mechanisms to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research

Stay updated on the latest advancements in thermal management technologies for semiconductor devices to incorporate cutting-edge solutions in future developments.

Questions about Semiconductor Integrated Circuit Device with Thermally Conducting Solder

What are the potential drawbacks of using thermally conducting solder in semiconductor devices?

Using thermally conducting solder in semiconductor devices can introduce challenges such as compatibility issues with other materials, reliability concerns over time, and increased manufacturing costs. However, these drawbacks can be mitigated through proper design and testing processes.

How does the integration of thermally conducting solder impact the overall performance of semiconductor devices?

The integration of thermally conducting solder in semiconductor devices enhances heat dissipation, leading to improved performance, reliability, and longevity of the devices. This technology helps prevent overheating, which can negatively affect the functionality and lifespan of semiconductor integrated circuits.

Original Abstract Submitted

A semiconductor integrated circuit device includes a first back-end-of-line region coupled to a first side of a front-end-of-line region, a second back-end-of-line region coupled to a second side of the front-end-of-line region, and a thermally conducting solder at least partially surrounding a perimeter of the front-end-of-line region, the first back-end-of-line region and the second back-end-of-line region.