18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng-Fan Yang of HSINCHU CITY (TW)
Yen-Chao Lin of HSINCHU CITY (TW)
Chi-Ming Yang of HSINCHU CITY (TW)
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18169212 titled 'SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
The semiconductor packaging device described in the abstract consists of a packaging module, a heat dissipation cover, and a thermal interface material layer. The packaging module includes a substrate with a working chip mounted on it. The heat dissipation cover is made of metal and is fixed on the substrate, covering the working chip. It features an accommodating recess to fit the working chip, as well as protrusive columns distributed within the recess at intervals. The thermal interface material layer, which is non-solid, is located within the accommodating recess between the protrusive columns to wrap them and make contact with the working chip, the metal cover, and the protrusive columns.
- Metal cover with accommodating recess and protrusive columns
- Thermal interface material layer within the accommodating recess
- Non-solid thermal interface material
- Efficient heat dissipation design
- Enhanced thermal conductivity
- Potential Applications:**
- Electronic devices requiring efficient heat dissipation - High-performance computing systems - Automotive electronics - Aerospace applications
- Problems Solved:**
- Overheating of semiconductor devices - Inadequate heat dissipation in compact electronic devices - Thermal management challenges in high-power applications
- Benefits:**
- Improved thermal performance - Enhanced reliability of semiconductor devices - Extended lifespan of electronic components - Increased efficiency in heat dissipation
- Commercial Applications:**
Title: Advanced Thermal Management Solutions for Semiconductor Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and telecommunications. It offers a competitive advantage by improving the thermal management of electronic devices, leading to enhanced performance and reliability.
- Questions about Semiconductor Packaging Devices:**
1. How does the thermal interface material layer contribute to the overall heat dissipation efficiency? 2. What are the key advantages of using a non-solid thermal interface material in semiconductor packaging devices?
Original Abstract Submitted
A semiconductor packaging device includes a packaging module, a heat dissipation cover and a thermal interface material layer. The package module includes a substrate, and a working chip mounted on the substrate. The heat dissipation cover includes a metal cover fixed on the substrate and covering the working chip, an accommodating recess located on the metal cover to accommodate the working chip, and a plurality of protrusive columns respectively formed on the metal cover and distributed within the accommodating recess at intervals. The depth of the accommodating recess is greater than the height of each protrusive column, and the accommodating recess is greater than the working chip. The thermal interface material layer is non-solid, and located within the accommodating recess between the protrusive columns to wrap the protrusive columns and contact with the working chip, the metal cover and the protrusive columns.
