18167095. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei-Yu Chen of Hsinchu City (TW)
Chien-Hsun Lee of Hsin-chu County (TW)
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18167095 titled 'PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
The abstract describes a package structure that includes multiple semiconductor dies, conductive terminals, and an insulating encapsulation. The second semiconductor die is stacked on and electrically connected to the first semiconductor die, with the conductive terminals also connected to the first semiconductor die. The insulating encapsulation surrounds the dies and terminals, with the terminals protruding from its surface.
- The package structure includes a first semiconductor die and at least one second semiconductor die stacked on top of each other.
- Conductive terminals are connected to the first semiconductor die and protrude from the insulating encapsulation.
- The insulating encapsulation surrounds the semiconductor dies and conductive terminals, providing protection and electrical insulation.
- The method for forming this package structure is also provided in the patent application.
- This innovation allows for efficient stacking and electrical connection of multiple semiconductor dies in a compact package.
Potential Applications: - This technology can be used in the manufacturing of integrated circuits and electronic devices. - It can be applied in the development of advanced semiconductor packages for various industries, including consumer electronics and automotive.
Problems Solved: - Provides a solution for stacking and electrically connecting multiple semiconductor dies in a compact package. - Ensures proper insulation and protection of the semiconductor components.
Benefits: - Improved efficiency in semiconductor packaging. - Enhanced reliability and performance of electronic devices. - Compact design for space-saving applications.
Commercial Applications: Title: Advanced Semiconductor Package Structure for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, tablets, and automotive systems. The compact design and efficient stacking of semiconductor dies offer manufacturers a competitive edge in the market.
Questions about the technology: 1. How does the insulating encapsulation provide protection to the semiconductor dies and conductive terminals? 2. What are the potential advantages of using this package structure in electronic devices?
Original Abstract Submitted
A package structure including a first semiconductor die, at least one second semiconductor die conductive terminals and an insulating encapsulation is provided. The at least one second semiconductor die is stacked on and electrically connected to the first semiconductor die. The conductive terminals are disposed on and electrically connected to the first semiconductor die. The insulating encapsulation laterally encapsulates the first semiconductor die, the at least one second semiconductor die and the conductive terminals, wherein the conductive terminals protrude from a surface of the insulating encapsulation. Furthermore, a method for forming the above-mentioned is also provided.
