18166517. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)
Contents
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Organization Name
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor(s)
Yu-Wei Huang of Chiayi City (TW)
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18166517 titled 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation: The semiconductor package structure includes a carrier, a circuit layer, and contacts connecting the circuit layer to the carrier, with each contact having a metal portion surrounded by an insulating portion, creating gaps between the contacts.
- Metal and insulating portions in contacts
- Gaps formed between contacts
- Circuit layer connected to carrier
- Semiconductor package structure design
- Electrical connections in the package
Potential Applications: 1. Electronics manufacturing 2. Semiconductor industry 3. Integrated circuit packaging
Problems Solved: 1. Ensuring proper electrical connections 2. Preventing short circuits 3. Enhancing semiconductor package reliability
Benefits: 1. Improved performance 2. Enhanced durability 3. Increased efficiency in electronic devices
Commercial Applications: The semiconductor package structure can be utilized in various electronic devices, such as smartphones, computers, and automotive electronics, to enhance their performance and reliability in the market.
Questions about Semiconductor Package Structure: 1. How does the design of the semiconductor package structure impact the overall performance of electronic devices? 2. What are the key factors to consider when implementing this technology in different commercial applications?
Original Abstract Submitted
A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a circuit layer, and a plurality of contacts electrically connecting the circuit layer to the carrier. Each contact includes a metal portion and an insulating portion. The insulating portion surrounds the metal portion. A gap is formed between the contacts.
