18165921. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chung-Ming Weng of Taichung City (TW)

Tzu-Sung Huang of Tainan City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Ming-Hung Tseng of Miaoli County (TW)

Tsung-Hsien Chiang of Hsinchu (TW)

Yen-Liang Lin of Taichung City (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18165921 titled 'PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a package structure for an electronic device, which includes a semiconductor die encapsulated by an insulating material and a redistribution layer structure on top of the die. The redistribution layer structure consists of various dielectric and conductive layers embedded within each other, with the outermost conductive layer being electrically connected to the electronic device. The backside dielectric layer has a ring-shaped recess covered by the outermost conductive layer.

• Semiconductor die encapsulated by an insulating material
• Redistribution layer structure with embedded dielectric and conductive layers
• Outermost conductive layer electrically connected to the electronic device
• Backside dielectric layer with a ring-shaped recess covered by the outermost conductive layer

Potential Applications

This technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve their performance and reliability.

Problems Solved

This technology helps in protecting the semiconductor die and improving the electrical connections within the electronic device, reducing the risk of damage and enhancing overall functionality.

Benefits

The benefits of this technology include increased durability, improved electrical performance, and enhanced overall reliability of electronic devices.

Potential Commercial Applications

This technology could be utilized in the consumer electronics industry for manufacturing advanced and reliable electronic devices.

Possible Prior Art

One possible prior art could be the use of redistribution layer structures in electronic devices to improve their performance and reliability.

How does this technology compare to existing packaging structures in terms of cost-effectiveness and performance?

This article does not provide a direct comparison with existing packaging structures in terms of cost-effectiveness and performance.

What are the specific electronic devices that could benefit the most from this technology?

The article does not specify the specific electronic devices that could benefit the most from this technology.

Original Abstract Submitted

A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. The electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.