18165920. METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chung-Liang Chang of Hsinchu City (TW)
Ming-Che Ho of Tainan City (TW)
Hung-Jui Kuo of Hsinchu City (TW)
METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18165920 titled 'METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
The abstract describes a method for forming a conductive material on a seed layer using an electrolytic plating process with a specific electrolytic composition.
- Seed layer is formed as the base.
- Conductive material is formed through an electrolytic plating process.
- Electrolytic composition includes copper ions, accelerator agent, and suppressor agent.
- The structure of the electrolytic composition is crucial for the plating process.
Potential Applications:
- Electronics manufacturing
- Printed circuit board production
- Semiconductor industry
Problems Solved:
- Efficient and precise formation of conductive materials
- Enhanced conductivity and durability of plated materials
Benefits:
- Improved quality of electronic components
- Cost-effective manufacturing process
- Increased productivity in the production of circuit boards
Commercial Applications:
- Suppliers of electronic components
- PCB manufacturing companies
- Semiconductor equipment manufacturers
Prior Art:
- Researchers can explore prior patents related to electrolytic plating processes and conductive material formation.
Frequently Updated Research:
- Stay updated on advancements in electrolytic plating techniques and materials for electronic applications.
Questions about the technology: 1. How does the specific electrolytic composition impact the quality of the conductive material formed? 2. What are the potential drawbacks of using electrolytic plating for conductive material formation?
Original Abstract Submitted
A method including the following steps is provided. A seed layer is formed. Conductive material is formed on the seed layer by performing an electrolytic plating process with an electrolytic composition comprising: a source of copper ions; an accelerator agent; and a suppressor agent, by structure represented (1) or (2):
