18165896. MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chien-Wei Wu of New Taipei City (TW)
Yung-Chi Lin of New Taipei City (TW)
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18165896 titled 'MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS
Simplified Explanation
The manufacturing method of a semiconductor package involves picking up a semiconductor device from a carrier using a pick and place device, placing and pressing the device onto a substrate, forming an encapsulating material over the substrate, forming a redistribution structure over the device and encapsulating material, and finally removing the substrate.
- Pick and place device with a flexible head and bonding portion for contacting the semiconductor device.
- Neck portion of the pick and place device is narrower than the bonding portion.
- Lateral encapsulation of the semiconductor device with encapsulating material.
- Formation of a redistribution structure over the device.
- Removal of the substrate after the process is complete.
Potential Applications
The technology can be applied in the manufacturing of various semiconductor packages for electronic devices such as smartphones, computers, and automotive components.
Problems Solved
This method helps in efficiently encapsulating and protecting semiconductor devices during the manufacturing process, ensuring their reliability and longevity.
Benefits
- Improved reliability of semiconductor devices. - Enhanced protection against external factors. - Streamlined manufacturing process.
Potential Commercial Applications
"Semiconductor Package Manufacturing Method for Electronic Devices"
Possible Prior Art
There may be prior art related to pick and place devices in semiconductor manufacturing processes, encapsulation techniques, and redistribution structures.
Unanswered Questions
How does the size of the neck portion of the pick and place device impact the overall efficiency of the manufacturing process?
The size of the neck portion may affect the precision and stability of the device when picking up and placing semiconductor devices. A smaller neck portion could potentially allow for more intricate movements but may also be more fragile.
What materials are commonly used for the encapsulating material in semiconductor packaging?
The type of material used for encapsulation can vary depending on the specific requirements of the semiconductor device. Common materials include epoxy resins, silicone compounds, and polyimides. Each material has its own set of properties that make it suitable for different applications.
Original Abstract Submitted
A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. The semiconductor device is placed and pressed onto a substrate by the pick and place device. An encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. A redistribution structure is formed over the semiconductor device and the encapsulating material. The substrate is removed.
