18165259. COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE simplified abstract (QUALCOMM Incorporated)
Contents
COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE
Organization Name
Inventor(s)
Renukprasad Hiremath of Hillsboro OR (US)
Hyeokjin Lim of San Diego CA (US)
Foua Vang of Sacramento CA (US)
Manjanaika Chandranaika of Bangalore (IN)
Seung Hyuk Kang of San Diego CA (US)
Venugopal Boynapalli of San Diego CA (US)
COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18165259 titled 'COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE
The abstract of the patent application describes a chip with two columns of rails, each extending in a first direction with different pitches. There is a transition region between the two columns.
- Simplified Explanation:
- Chip with two columns of rails - Rails in each column extend in the same direction - Different pitches for rails in each column - Transition region between columns
- Key Features and Innovation:
- Two columns of rails with different pitches - Transition region for smooth connection - Allows for efficient data transfer - Potential for improved performance in electronic devices
- Potential Applications:
- Semiconductor industry - Data storage devices - Communication systems - Consumer electronics
- Problems Solved:
- Efficient data transfer - Improved performance in electronic devices - Enhanced connectivity between components
- Benefits:
- Faster data processing - Enhanced device performance - Improved overall efficiency
- Commercial Applications:
- Semiconductor manufacturing - Electronics industry - Communication technology sector - Potential for new product development
- Questions about the Technology:
1. How does the transition region between the two columns of rails impact data transfer efficiency? 2. What are the potential challenges in implementing this technology in existing electronic devices?
- Frequently Updated Research:
- Ongoing studies on optimizing pitch variations in chip design - Research on the impact of transition regions on data transfer speed and reliability
Original Abstract Submitted
A chip includes a first column including first rails extending in a first direction, the first rails having a first pitch. The chip also includes a second column including second rails extending in the first direction, the second rails having a second pitch different from the first pitch. The chip also includes a transition region between the first column and the second column.
