18164212. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoshiharu Okada of Yokkaichi Mie (JP)
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18164212 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a substrate, a spacer, and a first member. The spacer is positioned on the substrate with three surfaces, one of which forms an angle of less than 90 degrees with respect to the second surface. The first member overlaps the spacer but does not make direct contact with it.
- The device includes a substrate, spacer, and first member.
- The spacer has three surfaces, with one forming an angle of less than 90 degrees with the second surface.
- The first member overlaps the spacer but does not touch it directly.
Potential Applications: - This technology could be used in semiconductor manufacturing processes. - It may find applications in electronic devices requiring precise spatial arrangements.
Problems Solved: - Provides a method for precise positioning of components in semiconductor devices. - Offers a solution for avoiding direct contact between certain components.
Benefits: - Enables accurate assembly of semiconductor devices. - Helps improve the performance and reliability of electronic components.
Commercial Applications: Title: Semiconductor Device Positioning Technology for Enhanced Performance This technology could be utilized in the production of advanced electronic devices, improving their functionality and reliability. It may have implications in industries such as telecommunications, computing, and consumer electronics.
Questions about Semiconductor Device Positioning Technology: 1. How does this technology improve the efficiency of semiconductor manufacturing processes? - This technology allows for precise positioning of components, leading to enhanced performance and reliability in electronic devices.
2. What are the potential cost-saving benefits of implementing this semiconductor device positioning technology? - By enabling accurate assembly and reducing the risk of component damage, this technology can help minimize production costs and improve overall product quality.
Original Abstract Submitted
A semiconductor device includes a substrate, a spacer, and a first member. The spacer is disposed on the substrate, and has (i) a first surface facing the substrate, (ii) a second surface opposite to the first surface, and (iii) a third surface, at least part of the third surface forming an angle of less than 90 degrees with respect to the second surface. The first member is disposed on the substrate and, when viewed in a first direction from the substrate toward the spacer, at least partly overlaps the spacer. The first member is not in contact with the spacer.
