18159111. FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS simplified abstract (International Business Machines Corporation)

FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS

Organization Name

International Business Machines Corporation

Inventor(s)

Kyu-hyoun Kim of Chappaqua NY (US)

Arvind Kumar of Stamford CT (US)

Joshua M. Rubin of Albany NY (US)

John W. Golz of Hopewell Junction NY (US)

Mounir Meghelli of Tarrytown NY (US)

FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18159111 titled 'FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS

The abstract of this patent application describes methods and structures for three-dimensional integrated circuits (3D ICs) with facilitator dies in a hierarchical configuration.

• Forming a plurality of stacked dies, including a bottom die with a first die type, upper dies with a second die type different from the first die type, and a facilitator die with a third die type different from the first and second die types.
• Hierarchically forming signal connections and power distribution lines between the bottom die, upper dies, and facilitator die.

Potential Applications: - Advanced semiconductor manufacturing - High-performance computing - Aerospace and defense technology

Problems Solved: - Enhancing signal integrity in 3D ICs - Improving power distribution efficiency - Facilitating complex hierarchical configurations in integrated circuits

Benefits: - Increased performance and reliability in electronic devices - Greater design flexibility in semiconductor industry - Potential for miniaturization and improved energy efficiency

Commercial Applications: Title: Advanced Hierarchical 3D IC Technology for Enhanced Performance This technology could be utilized in the development of next-generation processors, memory modules, and high-speed communication devices. The market implications include improved product competitiveness, reduced power consumption, and enhanced overall system performance.

Questions about 3D IC Technology: 1. How does hierarchical configuration benefit the performance of 3D ICs?

  Hierarchical configuration allows for optimized signal routing and power distribution, leading to improved performance and reliability in 3D ICs.

2. What are the key challenges in implementing facilitator dies in stacked integrated circuits?

  Implementing facilitator dies requires precise design and manufacturing processes to ensure proper functionality and compatibility with different die types.

Original Abstract Submitted

Embodiments of the present invention are directed to processing methods and resulting structures for three-dimensional integrated circuits (3D ICs) having facilitator dies in a hierarchical configuration. In a non-limiting embodiment, a method includes forming a plurality of stacked dies. The plurality of stacked dies includes a bottom die having a first die type, a plurality of upper dies having a second die type different than the first die type, and a facilitator die having a third die type different than the first die type and the second die type. At least one of a signal connection and a power distribution line are formed hierarchically between the bottom die, the plurality of upper dies, and the facilitator die.