18158982. CAPILLARY FOR STITCH BOND simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
CAPILLARY FOR STITCH BOND
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
CAPILLARY FOR STITCH BOND - A simplified explanation of the abstract
This abstract first appeared for US patent application 18158982 titled 'CAPILLARY FOR STITCH BOND
The abstract describes a semiconductor package with a semiconductor die, a bond pad, a bond wire, and a contact pad.
- The semiconductor die has a top surface with a bond pad formed on it.
- A bond wire is attached to the bond pad, with one end connected to it.
- The other end of the bond wire is attached to the contact pad using a stitch bond.
- The stitch bond has a plateau region between a cut end and a ramped portion.
- The bottom surface of the plateau region forms an attachment to the contact pad.
Potential Applications: - This technology can be used in the manufacturing of semiconductor packages for various electronic devices. - It can improve the reliability and performance of semiconductor components in applications such as consumer electronics, automotive systems, and industrial equipment.
Problems Solved: - Enhances the bond strength and electrical connectivity between the semiconductor die and the contact pad. - Provides a more secure and stable attachment for the bond wire in the semiconductor package.
Benefits: - Improved reliability and durability of semiconductor packages. - Enhanced electrical performance and signal integrity. - Cost-effective manufacturing process for semiconductor components.
Commercial Applications: Title: Semiconductor Package Technology for Enhanced Reliability in Electronic Devices This technology can be utilized in the production of integrated circuits, microprocessors, sensors, and other electronic components. It can benefit semiconductor manufacturers, electronics companies, and technology firms looking to enhance the performance and longevity of their products.
Questions about Semiconductor Package Technology: 1. How does the stitch bond improve the attachment between the bond wire and the contact pad? The stitch bond provides a secure connection by forming a plateau region that enhances the bond strength and stability of the attachment.
2. What are the potential market implications of implementing this semiconductor package technology in electronic devices? By improving the reliability and performance of semiconductor components, this technology can lead to increased customer satisfaction, reduced maintenance costs, and enhanced competitiveness for companies in the electronics industry.
Original Abstract Submitted
An example semiconductor package comprises a semiconductor die having a top surface, a bond pad formed on the top surface, a bond wire having a first end and a second end, wherein the first end is attached to the bond pad. The semiconductor package having a contact pad, wherein the second end of the wire bond is attached to the contact pad by a stitch bond, the stitch bond having a plateau region formed between a cut end and a ramped portion, wherein a bottom surface of the plateau region forms an attachment to the contact pad.
