18158379. BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract (Applied Materials, Inc.)
Contents
BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
Organization Name
Inventor(s)
Kallol Bera of Fremont CA (US)
Edward P. Hammond of Hillsborough CA (US)
Dmitry A. Dzilno of Sunnyvale CA (US)
Juan Carlos Rocha-alvarez of San Carlos CA (US)
BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18158379 titled 'BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
The patent application describes substrate support assemblies with an electrostatic chuck body that includes a substrate support surface and a substrate seat. The assemblies also include a support stem, a first bipolar electrode, and a second bipolar electrode embedded within the chuck body.
- The substrate support assemblies feature an electrostatic chuck body with a substrate support surface and a substrate seat.
- A support stem is coupled with the electrostatic chuck body for stability.
- A first bipolar electrode and a second bipolar electrode are embedded within the chuck body.
- The second bipolar electrode is entirely radially inward of at least a portion of the first bipolar electrode.
- The first and second bipolar electrodes are coaxial with each other.
- Each electrode is coupled with at least one RF power supply and at least one DC power supply.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding
Problems Solved: - Improved substrate handling and stability during manufacturing processes - Enhanced control over substrate positioning and alignment
Benefits: - Increased efficiency in semiconductor manufacturing - Higher quality thin film deposition - Reduced risk of substrate damage
Commercial Applications: Title: Advanced Substrate Support Assemblies for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance the precision and reliability of substrate handling processes, leading to improved product quality and manufacturing efficiency.
Questions about the technology: 1. How does the design of the substrate support assemblies improve substrate handling during manufacturing processes? - The design of the assemblies with embedded bipolar electrodes allows for better control and stability of the substrate, leading to more precise positioning and alignment.
2. What are the potential cost-saving benefits of using these substrate support assemblies in semiconductor manufacturing? - By improving substrate handling and reducing the risk of damage, these assemblies can help minimize production errors and material wastage, ultimately leading to cost savings for manufacturers.
Original Abstract Submitted
Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body. The assemblies may include a second bipolar electrode embedded within the electrostatic chuck body. An entirety of the second bipolar electrode may be radially inward of at least a portion of the first bipolar electrode. The first bipolar electrode and the second bipolar electrode may be coaxial with one another. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one RF power supply. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one DC power supply.
