18158090. Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract (Apple Inc.)

Selectively Dispensed Underfill and Edge Bond Patterns

Organization Name

Apple Inc.

Inventor(s)

Wei Chen of San Jose CA (US)

Balaji Nandhivaram Muthuraman of Reutlingen (DE)

Arun Sasi of Kirchheim unter Teck (DE)

Jie-Hua Zhao of Cupertino CA (US)

Suk-Kyu Ryu of Cupertino CA (US)

Jun Zhai of Cupertino CA (US)

Dominic Morache of Santa Clara CA (US)

Young Doo Jeon of San Jose CA (US)

Selectively Dispensed Underfill and Edge Bond Patterns - A simplified explanation of the abstract

This abstract first appeared for US patent application 18158090 titled 'Selectively Dispensed Underfill and Edge Bond Patterns

Simplified Explanation: The patent application describes microelectronic structures with selectively applied underfill material and/or edge bond material, creating isolated regions along the edges of electronic devices with vent openings.

• The innovation involves applying underfill material and/or edge bond material selectively to the edges of electronic devices.
• The applied materials form isolated regions that help improve the structural integrity of the devices.
• Vent openings are created along the edges to allow for the release of any trapped air or gases during the manufacturing process.
• This design helps prevent delamination and enhances the overall reliability of the electronic devices.
• The technology offers a more efficient and effective way to protect and strengthen microelectronic structures.

Potential Applications: This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics. It can also be used in industrial applications where reliable microelectronic structures are required.

Problems Solved: The technology addresses issues related to delamination, structural integrity, and reliability of microelectronic structures. By creating isolated regions with vent openings, it helps prevent common manufacturing defects and improves the overall performance of electronic devices.

Benefits: The benefits of this technology include enhanced structural integrity, improved reliability, and increased durability of electronic devices. It also provides a more efficient manufacturing process and reduces the risk of defects.

Commercial Applications: Title: Enhanced Microelectronic Structure Design for Improved Reliability This technology can be utilized in the consumer electronics industry to enhance the quality and durability of electronic devices. It can also be adopted in the industrial sector for applications requiring reliable microelectronic structures.

Questions about Microelectronic Structures with Selectively Applied Underfill Material and/or Edge Bond Material: 1. How does the selective application of underfill material and edge bond material improve the reliability of electronic devices? 2. What are the potential challenges in implementing this technology in large-scale manufacturing processes?

Frequently Updated Research: Stay updated on the latest advancements in microelectronic structure design and materials to further enhance the reliability and performance of electronic devices. Regularly check for new studies on underfill materials and edge bond techniques to stay informed on industry developments.

Original Abstract Submitted

Microelectronic structures with selectively applied underfill material and/or edge bond material are described. In an embodiment, isolated underfill regions and/or edge bond regions are applied to adjacent to one or more edges of an electronic device and form a plurality of vent openings along the one or more edges.