18156449. INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Makoto Shibuya of Sunnyvale CA (US)
Kwang-Soo Kim of Sunnyvale CA (US)
INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18156449 titled 'INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
Simplified Explanation: The patent application describes an electronic device with a semiconductor die attached to a substrate, an electronic component coupled to the circuit, and a package structure enclosing the semiconductor die with an opening exposing part of the electronic component.
Key Features and Innovation:
- Attachment of semiconductor die to substrate or die attach pad.
- Electrical connection process coupling semiconductor die to circuit.
- Formation of package structure enclosing semiconductor die with opening.
- Attachment of electronic component through opening to metal terminal.
Potential Applications: This technology could be used in various electronic devices such as smartphones, tablets, and computers where compact and efficient packaging of semiconductor components is required.
Problems Solved: This technology addresses the need for secure attachment and electrical connection of semiconductor dies in electronic devices while providing easy access for attaching electronic components.
Benefits:
- Improved reliability and performance of electronic devices.
- Enhanced efficiency in packaging semiconductor components.
- Simplified assembly process for electronic devices.
Commercial Applications: The technology could find applications in the consumer electronics industry, semiconductor manufacturing, and other sectors requiring advanced electronic packaging solutions.
Prior Art: Readers can explore prior art related to semiconductor packaging, die attachment methods, and electronic component integration in electronic devices to understand the evolution of this technology.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging technologies, die attachment techniques, and electronic component integration methods to leverage the latest innovations in the field.
Questions about Electronic Device Packaging: 1. What are the key components involved in the packaging of semiconductor dies in electronic devices? 2. How does the opening in the package structure facilitate the attachment of electronic components in the device?
Original Abstract Submitted
An electronic device includes a semiconductor die attached to a substrate and coupled to a circuit of the electronic device, an electronic component coupled to the circuit, and a package structure that encloses the semiconductor die, the package structure having an opening that exposes a portion of the electronic component. A method includes attaching a semiconductor die to a substrate or a die attach pad, performing an electrical connection process that couples the semiconductor die to a circuit, forming a package structure that encloses the semiconductor die and having an opening that exposes a metal terminal attached to the substrate, and attaching an electronic component through the opening to the metal terminal.
