18155784. HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract (International Business Machines Corporation)

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HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

Organization Name

International Business Machines Corporation

Inventor(s)

Tao Li of Slingerlands NY (US)

Ruilong Xie of Niskayuna NY (US)

Mukta Ghate Farooq of HOPEWELL JUNCTION NY (US)

Kisik Choi of Watervliet NY (US)

HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN - A simplified explanation of the abstract

This abstract first appeared for US patent application 18155784 titled 'HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

The semiconductor structure described in the abstract includes a device die with a device layer, a back-end-of-line (BEOL) structure on the frontside of the device layer, a frontside substrate attached to the BEOL structure, a backside power distribution network (BSPDN) structure on the backside of the device layer, and a backside substrate attached to the BSPDN structure. Additionally, a device package consisting of a base element and a lid element is included, with the device die attached to the base element through multiple C4 bumps at the frontside substrate and to the lid element at the backside substrate.

  • Device die with device layer
  • BEOL structure on frontside of device layer
  • Frontside substrate attached to BEOL structure
  • BSPDN structure on backside of device layer
  • Backside substrate attached to BSPDN structure
  • Device package with base element and lid element
  • Attachment of device die to base element and lid element
  • Use of multiple C4 bumps for attachment

Potential Applications: - Semiconductor manufacturing - Electronics industry - Power distribution systems

Problems Solved: - Efficient power distribution in semiconductor devices - Enhanced structural integrity of device packages

Benefits: - Improved performance of semiconductor devices - Enhanced reliability and durability - Simplified assembly process

Commercial Applications: - Semiconductor manufacturing companies - Electronics manufacturers - Power distribution system providers

Questions about Semiconductor Structure: 1. How does the attachment of the device die to the base and lid elements impact the overall performance of the semiconductor structure? 2. What are the key advantages of having a BSPDN structure on the backside of the device layer in terms of power distribution efficiency?


Original Abstract Submitted

Embodiments of present invention provide a semiconductor structure. The structure includes a device die including a device layer; a back-end-of-line (BEOL) structure on a frontside of the device layer and a frontside substrate attached to the BEOL structure; and a backside power distribution network (BSPDN) structure on a backside of the device layer and a backside substrate attached to the BSPDN structure; and a device package including a base element and a lid element, wherein the device die is attached to the base element of the device package through multiple C4 bumps at the frontside substrate and is attached to the lid element of the device package at the backside substrate. A method of forming the same is also provided.

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