18152626. Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Yung-Chi Lin of Su-Lin City (TW)
Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices - A simplified explanation of the abstract
This abstract first appeared for US patent application 18152626 titled 'Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices
The abstract of this patent application describes a device with an integrated circuit die and a semiconductor feature, each having chamfered corners and connected sidewalls.
- The device includes an integrated circuit die with three connected sidewalls forming a chamfered corner.
- A first dielectric surrounds the integrated circuit die.
- A semiconductor feature is placed over the integrated circuit die with chamfered corners and connected sidewalls.
- A second dielectric surrounds the semiconductor feature.
Potential Applications: This technology could be used in the manufacturing of electronic devices, such as smartphones, computers, and other consumer electronics.
Problems Solved: This innovation helps in improving the structural integrity and design flexibility of integrated circuit dies and semiconductor features.
Benefits: The chamfered corners and connected sidewalls enhance the overall durability and performance of the device, providing a more robust and efficient electronic component.
Commercial Applications: This technology could be highly valuable in the semiconductor industry, enabling the production of more reliable and advanced electronic devices.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor manufacturing processes and integrated circuit design techniques.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor technology and integrated circuit design to understand the evolving landscape of this field.
Questions about the technology: 1. How does the chamfered corner design impact the overall performance of the device? 2. What are the specific advantages of having connected sidewalls in the integrated circuit die and semiconductor feature?
Original Abstract Submitted
In an embodiment, a device includes an integrated circuit die including a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the integrated circuit die is connected to the first sidewall of the integrated circuit die and the second sidewall of the integrated circuit die, wherein the third sidewall of the integrated circuit die forms a chamfered corner of the integrated circuit die; a first dielectric surrounding the integrated circuit die; a semiconductor feature disposed over the integrated circuit die, wherein the semiconductor feature includes a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the semiconductor feature is connected to the first sidewall of the semiconductor feature and the second sidewall of the semiconductor feature and forms a chamfered corner of the semiconductor feature; and a second dielectric surrounding the semiconductor feature.
