18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Hung-Yi Kuo of Taipei City (TW)

Chen-Hua Yu of Hsinchu (TW)

Kuo-Chung Yee of Taoyuan City (TW)

Yu-Jen Lien of Tainan City (TW)

Ke-Han Shen of Chiayi City (TW)

Wei-Kong Sheng of Chu-Nan (TW)

Chung-Shi Liu of Hsinchu (TW)

Szu-Wei Lu of Hsinchu (TW)

Tsung-Fu Tsai of Changhua City (TW)

Chung-Ju Lee of Hsinchu (TW)

Chih-Ming Ke of Hsinchu (TW)

Package with Improved Heat Dissipation Efficiency and Method for Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 18152615 titled 'Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

Simplified Explanation

The patent application describes a package for an integrated circuit device with a heat dissipation structure, including a spreading layer with islands, pillars, and nanostructures.

• The package includes an integrated circuit device attached to a substrate.
• An encapsulant is disposed over the substrate and around the integrated circuit device, with a coplanar top surface.
• A heat dissipation structure is placed over the integrated circuit device and encapsulant, featuring a spreading layer with islands arranged in lines, pillars, and nanostructures.

Potential Applications

The technology described in the patent application could be applied in:

• High-performance computing systems
• Data centers
• Automotive electronics

Problems Solved

This technology addresses the following issues:

• Heat dissipation in integrated circuit devices
• Ensuring efficient cooling in compact electronic systems

Benefits

The benefits of this technology include:

• Improved thermal management
• Enhanced reliability and longevity of integrated circuit devices
• Increased performance in electronic systems

Potential Commercial Applications

The technology could find commercial applications in:

• Semiconductor manufacturing companies
• Electronics cooling system providers
• Consumer electronics manufacturers

Possible Prior Art

One possible prior art for this technology could be the use of heat spreaders in electronic devices to improve thermal management.

How does the arrangement of the islands in the spreading layer impact heat dissipation efficiency?

The patent application mentions that at least a portion of the islands are arranged as lines extending in a first direction in a plan view. It would be interesting to know the specific reasons behind this arrangement and how it affects heat dissipation.

What are the potential challenges in integrating nanostructures over the pillars for heat dissipation?

While the patent application describes the use of nanostructures over the pillars for heat dissipation, it does not delve into the challenges or limitations of this integration process. Understanding these aspects could provide insights into the practical implementation of the technology.

Original Abstract Submitted

In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.