18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Tzuan-Horng Liu of Longtan Township (TW)
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18152453 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Simplified Explanation: The patent application describes a stacked semiconductor device where a first package is embedded in a second package. The process involves mounting an integrated circuit device to a workpiece, depositing underfill, and encapsulating the device.
Key Features and Innovation:
- Stacked semiconductor device with embedded packages
- Use of solder connectors to mount integrated circuit devices
- Deposition of underfill and encapsulant for protection
- Lateral surrounding of integrated circuit devices and packages
Potential Applications: The technology can be used in various electronic devices such as smartphones, computers, and IoT devices.
Problems Solved: The technology addresses the need for compact and efficient semiconductor packaging solutions.
Benefits:
- Improved protection for integrated circuit devices
- Enhanced reliability and durability of semiconductor packages
- Space-saving design for stacked semiconductor devices
Commercial Applications: The technology can be applied in the consumer electronics industry for manufacturing compact and reliable electronic devices.
Prior Art: Readers can explore prior art related to stacked semiconductor devices, embedded packages, and semiconductor packaging technologies.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies and embedded package designs.
Questions about Stacked Semiconductor Devices: 1. How does the use of underfill and encapsulant improve the reliability of semiconductor packages? 2. What are the potential challenges in manufacturing stacked semiconductor devices with embedded packages?
Original Abstract Submitted
Embodiments include a stacked semiconductor device and methods of forming the same. The stacked semiconductor device includes a first package embedded in a second package. Forming the first package includes mounting a first integrated circuit device to a first workpiece by a first set of solder connectors, depositing a first underfill between the first integrated circuit device and the first workpiece, and forming a first encapsulant laterally surrounding the first integrated circuit device. The first package is mounted to a second workpiece by a second set of solder connectors, a second underfill is deposited between the first package and the second workpiece, and a second encapsulant is deposited to laterally surround the first package.
