18151545. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
INTEGRATED CIRCUIT PACKAGES AND METHODS
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yuan Sheng Chiu of Miaoli city (TW)
Tsung-Shu Lin of New Taipei City (TW)
INTEGRATED CIRCUIT PACKAGES AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151545 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS
The abstract describes an integrated circuit package with a perforated stiffener ring and the method of forming it. The package includes an integrated circuit die on a substrate, underfill between the die and substrate, and a stiffener ring encircling the package with a perforated region.
- The integrated circuit package includes an integrated circuit die on a substrate, underfill, and a stiffener ring encircling the package.
- The stiffener ring has a perforated region with openings from the top surface to the bottom surface.
- The perforated stiffener ring provides structural support while allowing for flexibility and reduced weight.
- This innovation enhances the reliability and durability of integrated circuit packages.
- The method of forming the package involves attaching the stiffener ring to the substrate after placing the integrated circuit die.
Potential Applications: - This technology can be used in various electronic devices requiring integrated circuit packages. - It can be beneficial in applications where weight reduction and structural support are essential.
Problems Solved: - Addresses the need for improved structural support in integrated circuit packages. - Solves the challenge of balancing flexibility and rigidity in electronic components.
Benefits: - Enhanced reliability and durability of integrated circuit packages. - Reduced weight and improved flexibility in electronic devices.
Commercial Applications: Title: Perforated Stiffener Ring for Integrated Circuit Packages This technology can be applied in the manufacturing of consumer electronics, automotive electronics, and industrial equipment where lightweight and durable integrated circuit packages are required.
Questions about Perforated Stiffener Ring for Integrated Circuit Packages: 1. How does the perforated stiffener ring improve the reliability of integrated circuit packages? - The perforated stiffener ring provides structural support while allowing for flexibility, enhancing the overall durability of the package.
2. What are the potential applications of integrated circuit packages with perforated stiffener rings? - These packages can be used in various electronic devices where weight reduction and structural support are crucial for performance and longevity.
Original Abstract Submitted
An integrated circuit package with a perforated stiffener ring and the method of forming the same are provided. The integrated circuit package may comprise an integrated circuit package component having an integrated circuit die on a substrate, an underfill between the integrated circuit package component and the substrate, and a stiffener ring attached to the substrate. The stiffener ring may encircle the integrated circuit package component and the underfill in a top-down view. The stiffener ring may comprise a perforated region, wherein the perforated region may comprise an array of openings extending from a top surface of the stiffener ring to a bottom surface of the stiffener ring.
