18150806. IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
Contents
- 1 IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Inventor(s)
FENG-CHIEN Hsieh of PINGTUNG COUNTY (TW)
YUN-WEI Cheng of TAIPEI CITY (TW)
KUO-CHENG Lee of TAINAN CITY (TW)
CHENG-MING Wu of TAINAN CITY (TW)
IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18150806 titled 'IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The image sensing structure described in the patent application includes a first semiconductor device and a second semiconductor device. The first semiconductor device consists of at least one first unit, which includes a row selector, analog-to-digital converter (ADC), and a plurality of first interconnects. The second semiconductor device includes at least one second unit, which features a photodiode facing the top side of the device to receive incident light. The first semiconductor device is bonded to the bottom side of the second semiconductor device.
- The patent application describes an image sensing structure with two semiconductor devices, each containing specific units for image sensing and processing.
- The first semiconductor device includes a row selector, ADC, and interconnects, while the second semiconductor device features a photodiode for capturing light.
- The bonding of the two semiconductor devices enables efficient image sensing and processing capabilities.
Potential Applications
The technology described in the patent application could be applied in:
- Digital cameras
- Medical imaging devices
- Surveillance systems
Problems Solved
The image sensing structure addresses the following issues:
- Efficient image sensing and processing in a compact design
- Enhanced light capture and conversion capabilities
Benefits
The benefits of this technology include:
- Improved image quality
- Faster image processing
- Compact and integrated design
Potential Commercial Applications
The technology could find commercial applications in:
- Smartphone cameras
- Security cameras
- Medical imaging equipment
Possible Prior Art
One possible prior art for this technology could be the development of integrated image sensing structures in semiconductor devices for various applications.
Unanswered Questions
1. How does the bonding of the two semiconductor devices impact the overall performance of the image sensing structure? 2. Are there any specific limitations or challenges associated with the implementation of this technology in practical devices?
Original Abstract Submitted
The image sensing structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes at least one first unit. The at least one first unit includes a plurality of first interconnects adjacent to the top side of the first semiconductor device, a row selector, and an analog-to-digital converter (ADC) connected to the row selectors. The second semiconductor device includes at least one second unit. The at least one second unit includes a photodiode facing the top side of the second semiconductor device. The photodiode is configured to receive the light incident on the top side of the second semiconductor device. The top side of the first semiconductor device is bonded to the bottom side of the second semiconductor device.
