18150510. CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS simplified abstract (Texas Instruments Incorporated)

CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS

Organization Name

Texas Instruments Incorporated

Inventor(s)

Rafael Jose Lizares Guevara of Angeles (PH)

CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18150510 titled 'CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS

The semiconductor package described in the patent application includes a semiconductor die with a circuit, a housing covering the die, a conductive terminal connected to the die and exposed on the housing's exterior surface, a sensor on the exterior surface, a flux layer on the conductive terminal, and a conductive member on the flux layer. The conductive member consists of a copper core, a nickel layer on the core, and a solder layer on the nickel.

• The semiconductor package comprises a unique conductive member structure with a copper core, nickel layer, and solder layer.
• The package includes a sensor exposed on the exterior surface of the housing, enhancing its functionality.
• The flux layer on the conductive terminal improves the overall performance and reliability of the package.
• The conductive terminal is coupled to the semiconductor die, ensuring efficient electrical connections.
• The housing provides protection to the semiconductor die and other components within the package.

Potential Applications: - This technology can be used in various electronic devices requiring reliable semiconductor packaging. - It can be applied in automotive electronics, consumer electronics, and industrial equipment.

Problems Solved: - Ensures secure and efficient electrical connections within the semiconductor package. - Enhances the overall performance and reliability of electronic devices.

Benefits: - Improved functionality and reliability of electronic devices. - Enhanced protection for semiconductor components. - Efficient electrical connections for optimal performance.

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the manufacturing of various electronic devices, catering to industries such as automotive, consumer electronics, and industrial equipment. The enhanced reliability and performance offered by this semiconductor packaging solution can lead to increased market competitiveness and customer satisfaction.

Questions about Semiconductor Packaging Technology: 1. How does the unique conductive member structure in this semiconductor package improve its performance? The unique conductive member structure, consisting of a copper core, nickel layer, and solder layer, ensures efficient electrical connections and enhances the overall reliability of the semiconductor package.

2. What are the potential applications of this semiconductor packaging technology in different industries? This semiconductor packaging technology can be applied in various electronic devices across industries such as automotive, consumer electronics, and industrial equipment, where reliable and efficient semiconductor packaging is essential for optimal device performance.

Original Abstract Submitted

In examples, a semiconductor package comprises a semiconductor die including a circuit, a housing covering the semiconductor die, and a conductive terminal coupled to the semiconductor die and exposed to an exterior surface of the housing. The package also comprises a sensor exposed on the exterior surface of the housing, a flux layer on the conductive terminal and a conductive member on the flux layer. The conductive member includes a copper core, a nickel layer covering the copper core, and a solder layer covering the nickel layer.