18150406. COOLED POWER MODULE simplified abstract (GM Global Technology Operations LLC)

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COOLED POWER MODULE

Organization Name

GM Global Technology Operations LLC

Inventor(s)

Muhammad Hussain Alvi of Troy MI (US)

Junghoon Kim of ANN ARBOR MI (US)

Yilun Luo of Ann Arbor MI (US)

Kevin David Corpetti-vazquez of Davisburg MI (US)

COOLED POWER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18150406 titled 'COOLED POWER MODULE

The patent application describes a 1.5 sided cooled power module for improved cooling and gate connections.

  • The cooled power module includes an upside direct bond copper (DBC) with a first top copper layer, a first bottom copper layer, and a first dielectric layer.
  • A downside DBC is also included, with a second top copper layer, a second bottom copper layer, and a second dielectric layer.
  • One or more dies are positioned between the upside DBC and the downside DBC.
  • The upside DBC is sized so that a portion of the top surface of the dies remains exposed.
  • Bond wires are placed on the exposed portion of the dies and terminated on the first top copper layer of the upside DBC.

Potential Applications: - Power electronics - Automotive industry - Renewable energy systems

Problems Solved: - Enhanced cooling for power modules - Improved gate connections - Efficient power distribution

Benefits: - Increased efficiency - Better thermal management - Enhanced reliability

Commercial Applications: Title: Advanced Cooling Solutions for Power Modules This technology can be used in various industries such as automotive, renewable energy, and power electronics for improved performance and reliability.

Questions about the technology: 1. How does the 1.5 sided cooling system improve the efficiency of power modules? 2. What are the key advantages of using direct bond copper in this cooling system?


Original Abstract Submitted

Aspects of the disclosure include a 1.5 sided cooled power module for enhanced cooling and gate connections. An exemplary cooled power module can include an upside direct bond copper (DBC) having a first top copper layer, a first bottom copper layer, and a first dielectric layer between the first top copper layer and the first bottom copper layer. A downside DBC includes a second top copper layer, a second bottom copper layer, and a second dielectric layer between the second top copper layer and the second bottom copper layer. One or more dies are positioned between the upside DBC and the downside DBC. The upside DBC is sized such that a portion of an uppermost surface of the one or more dies remains exposed. Bond wires are placed on the exposed portion of the one or more dies and terminated on the first top copper layer of the upside DBC.

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