18150379. POWER MODULE THERMAL MANAGEMENT simplified abstract (GM Global Technology Operations LLC)
Contents
POWER MODULE THERMAL MANAGEMENT
Organization Name
GM Global Technology Operations LLC
Inventor(s)
Chandra S. Namuduri of Troy MI (US)
POWER MODULE THERMAL MANAGEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18150379 titled 'POWER MODULE THERMAL MANAGEMENT
The patent application describes a power module with enhanced thermal management, including a direct bond copper (DBC) substrate and a thin-film thermoelectric cooler (TFTEC) to regulate temperature.
- The power module features a DBC substrate with top and bottom copper layers separated by a dielectric layer.
- A TFTEC with a thermoelectric film is positioned between insulators to cool the system.
- One or more dies are placed over the DBC substrate and TFTEC, with a controller adjusting the TFTEC current based on die temperature.
Potential Applications: - This technology can be used in electronic devices to improve thermal performance and extend the lifespan of components. - It can also be applied in automotive systems to enhance efficiency and reliability.
Problems Solved: - Addresses overheating issues in power modules, preventing damage to sensitive electronic components. - Improves overall system performance by maintaining optimal operating temperatures.
Benefits: - Enhanced thermal management leads to increased system reliability and longevity. - Improved efficiency and reduced maintenance costs for electronic and automotive applications.
Commercial Applications: - This technology has potential applications in consumer electronics, automotive systems, and industrial equipment, offering improved performance and reliability in various sectors.
Questions about the technology: 1. How does the TFTEC in the power module help regulate temperature effectively?
- The TFTEC uses a thermoelectric film to transfer heat away from the components, maintaining optimal operating temperatures.
2. What are the key advantages of using a DBC substrate in the power module design?
- The DBC substrate provides efficient heat dissipation and electrical conductivity, enhancing the overall performance of the system.
Original Abstract Submitted
Aspects of the disclosure include a power module having enhanced thermal management. An exemplary power module can include a direct bond copper (DBC) substrate having a top copper layer, a bottom copper layer, and a dielectric layer between the top copper layer and the bottom copper layer. The power module includes a thin-film thermoelectric cooler (TFTEC) having a thermoelectric film positioned between a top insulator and a bottom insulator. One or more dies are positioned over the DBC substrate and the TFTEC and a controller is configured to adjust a thermoelectric device current of the TFTEC responsive to a temperature of the one or more dies.
