18150324. METHOD OF FABRICATING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18150324 titled 'METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
Simplified Explanation
The disclosed patent application describes a method for fabricating semiconductors. The method involves forming two conductive structures, measuring the misalignment between them, selecting a reticle from a set of reticles based on the measured misalignment, and using the selected reticle to form a connection conductive structure that electrically connects the two initial conductive structures.
- The method involves forming and aligning conductive structures in semiconductor fabrication.
- A misalignment value is measured between the two conductive structures.
- A reticle is selected from a set of reticles based on the measured misalignment value.
- The selected reticle is used to form a connection conductive structure that connects the two initial conductive structures.
Potential applications of this technology:
- Semiconductor fabrication processes can benefit from improved alignment techniques.
- This method can be used in the production of integrated circuits and other semiconductor devices.
- It can enhance the reliability and performance of electronic components.
Problems solved by this technology:
- Misalignment between conductive structures can lead to faulty connections and reduced device performance.
- This method addresses the issue of misalignment by measuring and compensating for it during the fabrication process.
- It ensures accurate alignment and improves the overall quality of the semiconductor devices.
Benefits of this technology:
- Improved alignment accuracy leads to better electrical connections between conductive structures.
- Enhanced device performance and reliability.
- Increased yield and reduced manufacturing defects.
- Cost savings due to improved process efficiency.
Original Abstract Submitted
Disclosed is a semiconductor fabrication method comprising forming a first conductive structure and a second conductive structure, measuring a misalignment value between the first conductive structure and the second conductive structure, based on the measured misalignment value selecting a reticle from a set of reticles, and using the selected reticle to form a connection conductive structure that electrically connects the first conductive structure to the second conductive structure.
