18150324. METHOD OF FABRICATING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Keunnam Kim of Suwon-si (KR)

Kiseok Lee of Suwon-si (KR)

Byeongjoo Ku of Suwon-si (KR)

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18150324 titled 'METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

Simplified Explanation

The disclosed patent application describes a method for fabricating semiconductors. The method involves forming two conductive structures, measuring the misalignment between them, selecting a reticle from a set of reticles based on the measured misalignment, and using the selected reticle to form a connection conductive structure that electrically connects the two initial conductive structures.

  • The method involves forming and aligning conductive structures in semiconductor fabrication.
  • A misalignment value is measured between the two conductive structures.
  • A reticle is selected from a set of reticles based on the measured misalignment value.
  • The selected reticle is used to form a connection conductive structure that connects the two initial conductive structures.

Potential applications of this technology:

  • Semiconductor fabrication processes can benefit from improved alignment techniques.
  • This method can be used in the production of integrated circuits and other semiconductor devices.
  • It can enhance the reliability and performance of electronic components.

Problems solved by this technology:

  • Misalignment between conductive structures can lead to faulty connections and reduced device performance.
  • This method addresses the issue of misalignment by measuring and compensating for it during the fabrication process.
  • It ensures accurate alignment and improves the overall quality of the semiconductor devices.

Benefits of this technology:

  • Improved alignment accuracy leads to better electrical connections between conductive structures.
  • Enhanced device performance and reliability.
  • Increased yield and reduced manufacturing defects.
  • Cost savings due to improved process efficiency.


Original Abstract Submitted

Disclosed is a semiconductor fabrication method comprising forming a first conductive structure and a second conductive structure, measuring a misalignment value between the first conductive structure and the second conductive structure, based on the measured misalignment value selecting a reticle from a set of reticles, and using the selected reticle to form a connection conductive structure that electrically connects the first conductive structure to the second conductive structure.