18148945. PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract (Intel Corporation)
Contents
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
Organization Name
Inventor(s)
Changhua Liu of Chandler AZ (US)
Robert May of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18148945 titled 'PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
The patent application describes methods, apparatus, systems, and articles of manufacture that utilize photonic integrated circuits with glass cores.
- Glass cores are used in a primary package substrate with first contacts on the outer surface.
- A photonic integrated circuit (PIC) is located within the primary package substrate next to the glass core.
- A secondary package substrate supports a semiconductor die with second contacts on the other side.
- The first contacts on the primary package substrate are electrically connected to the second contacts on the secondary package substrate.
Potential Applications: - Optical communication systems - Data transmission networks - High-speed computing devices
Problems Solved: - Improved signal transmission efficiency - Enhanced integration of photonic components - Increased reliability of semiconductor devices
Benefits: - Higher performance in data transfer - Reduced power consumption - Enhanced durability of integrated circuits
Commercial Applications: Title: "Next-Generation Optical Communication Systems" This technology can be applied in telecommunications, data centers, and high-performance computing industries, leading to faster and more reliable data transmission.
Questions about the technology: 1. How does the use of glass cores in photonic integrated circuits improve signal transmission efficiency? 2. What are the potential challenges in integrating semiconductor dies with glass core-based photonic integrated circuits?
Original Abstract Submitted
Methods, apparatus, systems, and articles of manufacture are disclosed utilizing photonic integrated circuits with glass cores. An example apparatus comprises a primary package substrate including a glass core and first contacts along an outer surface of the primary package substrate, a photonic integrated circuit (PIC) within the primary package substrate adjacent a surface of the glass core, and a secondary package substrate supporting a semiconductor die on a first side of the secondary package substrate, the secondary package substrate including second contacts on a second side of the secondary package substrate, the first contacts electrically coupled to the second contacts.
