18146447. Hall Sensor Using Face Down Structure with Through Substrate Vias simplified abstract (Texas Instruments Incorporated)
Contents
Hall Sensor Using Face Down Structure with Through Substrate Vias
Organization Name
Texas Instruments Incorporated
Inventor(s)
Masamitsu Matsuura of Beppu (JP)
Hall Sensor Using Face Down Structure with Through Substrate Vias - A simplified explanation of the abstract
This abstract first appeared for US patent application 18146447 titled 'Hall Sensor Using Face Down Structure with Through Substrate Vias
The abstract describes an integrated circuit (IC) package that includes a semiconductor die with a Hall-effect sensor circuit and through substrate vias (TSV) extending from one surface to another. The package also features a leadframe with leads providing current paths for magnetic field generation and attachment to the semiconductor die.
- Semiconductor die with Hall-effect sensor circuit and TSVs
- Leadframe with leads for magnetic field generation and attachment to die
- Insulator attached to leadframe and semiconductor die
- Die attach and bonding materials used for attachment
- Integration of components for efficient sensor operation
Potential Applications: - Automotive industry for position sensing in vehicles - Industrial automation for precise motion control - Consumer electronics for touchless gesture recognition
Problems Solved: - Improved accuracy and sensitivity of Hall-effect sensor - Enhanced reliability and durability of IC package - Efficient integration of components for compact design
Benefits: - Higher performance and accuracy in magnetic field sensing - Increased reliability and longevity of sensor operation - Compact and cost-effective design for various applications
Commercial Applications: Title: Advanced Hall-Effect Sensor IC Package for Automotive and Industrial Applications This technology can be used in automotive systems for position sensing, industrial automation for motion control, and consumer electronics for touchless gesture recognition. The market implications include improved sensor performance, reliability, and cost-effectiveness.
Prior Art: Readers can explore prior art related to Hall-effect sensors, semiconductor packaging, and leadframe technology to understand the evolution of this integrated circuit package.
Frequently Updated Research: Researchers are constantly working on enhancing the sensitivity and accuracy of Hall-effect sensors, optimizing semiconductor packaging techniques, and improving the integration of components in IC packages.
Questions about Hall-Effect Sensor IC Package: 1. How does the integration of through substrate vias (TSVs) improve the performance of the Hall-effect sensor circuit? 2. What are the key differences between traditional leadframe packages and the innovative IC package described in the abstract?
Original Abstract Submitted
An integrated circuit (IC) package comprises a semiconductor die having a first surface with a Hall-effect sensor circuit and a second surface. A plurality of through substrate vias (TSV) each having a metal layer extend from the first surface of the semiconductor die to the second surface. The IC package includes a portion of a leadframe having a first set of leads and a second set of leads. The first set of leads provide a field generating current path for directing a magnetic field toward the Hall-effect sensor circuit. The second set of leads are attached to bond pads on the semiconductor die. A first side of an insulator is attached to the leadframe using a die attach material, and a second side of the insulator is attached to the first side of the semiconductor die using a bonding material.
