18145840. DECOUPLING MIM CAPACITOR simplified abstract (International Business Machines Corporation)
Contents
DECOUPLING MIM CAPACITOR
Organization Name
International Business Machines Corporation
Inventor(s)
Tao Li of Slingerlands NY (US)
Tsung-Sheng Kang of Ballston Lake NY (US)
Kangguo Cheng of Schenectady NY (US)
Ruilong Xie of Niskayuna NY (US)
DECOUPLING MIM CAPACITOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18145840 titled 'DECOUPLING MIM CAPACITOR
Simplified Explanation: The patent application describes a semiconductor device with a backside power rail, source-drain region, and metal-insulator-metal capacitor connected through a metal contact.
- The semiconductor device includes a backside power rail (BSPR).
- A source-drain (S/D) region is connected to the BSPR.
- A metal-insulator-metal capacitor (MIMC) is present, with the BSPR directly connecting to the MIMC via a metal contact called MIMC via for backside power rail (VBPR).
Key Features and Innovation:
- Integration of a backside power rail in a semiconductor device.
- Direct connection between the backside power rail and metal-insulator-metal capacitor.
- Use of a metal contact for connecting the backside power rail to the capacitor.
Potential Applications: This technology can be applied in the semiconductor industry for enhancing power distribution and efficiency in devices.
Problems Solved:
- Improved power distribution within semiconductor devices.
- Enhanced connectivity between different components in the device.
Benefits:
- Increased efficiency in power distribution.
- Enhanced performance of semiconductor devices.
- Improved overall functionality.
Commercial Applications: Potential commercial applications include the manufacturing of advanced semiconductor devices for various electronic products, such as smartphones, computers, and IoT devices.
Prior Art: Readers can explore prior patents related to semiconductor device structures and power distribution methods in the semiconductor industry.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology and power distribution methods to enhance the efficiency and performance of electronic devices.
Questions about Semiconductor Device with Backside Power Rail: 1. What are the key components of a semiconductor device with a backside power rail? 2. How does the direct connection between the backside power rail and metal-insulator-metal capacitor improve device performance?
Original Abstract Submitted
Semiconductor structures, devices and methods of fabricating the same, including a semiconductor device that includes a backside power rail (BSPR), a source-drain (S/D) region connected to the BSPR, and a metal-insulator-metal capacitor (MIMC), where the BSPR directly connects to the MIMC by a MIMC via for backside power rail (VBPR) metal contact.
