18139674. APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
APPARATUS FOR MEASURING AN ADHESION FORCE
Organization Name
Inventor(s)
Seungdae Seok of Suwon-si (KR)
Byeongtak Park of Suwon-si (KR)
APPARATUS FOR MEASURING AN ADHESION FORCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18139674 titled 'APPARATUS FOR MEASURING AN ADHESION FORCE
The abstract describes an apparatus for measuring adhesion force, consisting of a stage supporting a specimen and a sensor attached to the specimen to detect the adhesion force required to detach the sensor.
- The apparatus includes a stage for specimen support and a sensor for adhesion force measurement.
- The sensor is adhered to the specimen to detect the force needed to detach it.
- The adhesion force measured is crucial for understanding the bonding strength of materials.
- This innovation can be used in material science research, quality control in manufacturing, and product development.
- By accurately measuring adhesion force, this apparatus can help in optimizing material properties and product performance.
Potential Applications: - Material science research - Quality control in manufacturing processes - Product development for industries like automotive, aerospace, and electronics
Problems Solved: - Lack of accurate measurement of adhesion force in materials - Difficulty in assessing bonding strength for various applications
Benefits: - Enhanced understanding of material bonding properties - Improved product quality and performance through optimized material selection - Facilitates research and development in material science
Commercial Applications: Title: Adhesion Force Measurement Apparatus for Material Science and Manufacturing This technology can be utilized in industries such as automotive, aerospace, and electronics for quality control, product development, and material research, leading to improved products and processes.
Questions about Adhesion Force Measurement Apparatus: 1. How does the apparatus accurately measure adhesion force? The apparatus measures adhesion force by detecting the force required to detach the sensor from the specimen, providing a precise measurement of bonding strength.
2. What are the potential applications of this technology beyond material science research? In addition to material science research, this technology can be applied in industries like manufacturing, automotive, and aerospace for quality control and product development purposes.
Original Abstract Submitted
An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
